MT47H512M4THN-3:E TR

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Mfr.Part #
MT47H512M4THN-3:E TR
Manufacturer
Micron Technology
Package / Case
63-FBGA
Datasheet
Download
Description
IC DRAM 2GBIT PARALLEL 63FBGA
Stock
7,770
In Stock :
7,770

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Manufacturer :
Micron Technology
Product Category :
Memory
Published :
2002
Base Part Number :
MT47H512M4
Memory Interface :
Parallel
Access Time :
450ps
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
2Gb 512M x 4
Memory Type :
Volatile
Mounting Type :
Surface Mount
Clock Frequency :
333MHz
Voltage - Supply :
1.7V~1.9V
Write Cycle Time - Word, Page :
15ns
Memory Format :
DRAM
RoHS Status :
ROHS3 Compliant
Packaging :
Tape and Reel (TR)
Operating Temperature :
0°C~85°C TC
Package / Case :
63-FBGA
Introducing Memory Micron Technology MT47H512M4THN-3:E TR from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:MT47H512M4, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TC, Package / Case:63-FBGA, MT47H512M4THN-3:E TR pinout, MT47H512M4THN-3:E TR datasheet PDF, MT47H512M4THN-3:E TR amp .Beyond Memory Micron Technology MT47H512M4THN-3:E TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H512M4THN-3:E TR


Memory Micron Technology MT47H512M4THN-3:E TR Overview

The Memory Micron Technology MT47H512M4THN-3:E TR is a high-performance IC DRAM designed for applications requiring large amounts of fast and reliable memory. With a capacity of 2 Gbits and utilizing a parallel interface, this DRAM is housed in a compact 63FBGA package that meets rigorous industry standards for size, performance, and durability. This product is specifically engineered to address the needs of advanced computing systems where high memory bandwidth and low latency are essential. The incorporation of the Memory Micron Technology MT47H512M4THN-3:E TR into your hardware infrastructure ensures robust performance and supports higher data rates which are vital in today's technology ecosystems.

MT47H512M4THN-3:E TR Features

This DRAM module boasts several features designed to enhance its performance and reliability. Key features include a high data bandwidth, low power consumption, and improved thermal characteristics, making it ideal for sustained high-performance operations. Additionally, the compact 63FBGA package allows for efficient use of PCB space, facilitating more dense configurations and ultimately, more powerful system designs.

MT47H512M4THN-3:E TR Applications

  • Advanced Computing Systems: Utilized in servers and high-end workstations to manage large databases and complex applications, enhancing processing speed and reliability.
  • Networking Equipment: Ideal for use in routers, switches, and other networking hardware where fast data retrieval and storage are crucial to maintaining high-speed network communications.
  • Consumer Electronics: Embedded in consumer electronics such as high-definition televisions and gaming consoles, providing the necessary speed and capacity for enhanced user experiences.
  • Telecommunications Infrastructure: Supports telecommunications systems, including base stations and signal processing equipment, requiring robust memory solutions for real-time data processing.
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Shipping Cost

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