MT29F512G08CFCBBWP-10:B

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Mfr.Part #
MT29F512G08CFCBBWP-10:B
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 512GBIT PAR 48TSOP I
Stock
16,903
In Stock :
16,903

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Memory Format :
Flash
Memory Size :
512Gb 64G x 8
Operating Supply Voltage :
3.3V
Clock Frequency :
100MHz
Memory Interface :
Parallel
RoHS Status :
ROHS3 Compliant
Supplier Device Package :
48-TSOP I
Packaging :
Tray
Memory Type :
Non-Volatile
Mounting Type :
Surface Mount
Operating Temperature :
0°C~70°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
2.7V~3.6V
Introducing Memory Micron Technology MT29F512G08CFCBBWP-10:B from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:48-TFSOP (0.724, 18.40mm Width), Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, MT29F512G08CFCBBWP-10:B pinout, MT29F512G08CFCBBWP-10:B datasheet PDF, MT29F512G08CFCBBWP-10:B amp .Beyond Memory Micron Technology MT29F512G08CFCBBWP-10:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F512G08CFCBBWP-10:B


Memory Micron Technology MT29F512G08CFCBBWP-10:B Overview

The Memory Micron Technology MT29F512G08CFCBBWP-10:B is a high-capacity, parallel interface NAND Flash memory device, designed for applications where durability, reliability, and high data throughput are paramount. With a dense 512 Gbit architecture, this product from Micron Technology offers extensive storage potential for complex, data-intensive operations. Its utilization of advanced manufacturing technology ensures robust performance and longevity, making it an ideal choice for enterprise-level solutions and demanding industrial environments where data integrity is critical. This Flash memory unit is tailored to meet the rigorous requirements of B2B clients looking for massive storage solutions in compact form factors.

MT29F512G08CFCBBWP-10:B Features

The MT29F512G08CFCBBWP-10:B Flash memory chip boasts a range of features designed to enhance functionality and performance. These include a high-speed parallel interface, excellent endurance and reliability under extended operational temperatures, and support for bad block management and wear leveling algorithms that enhance the lifespan and reliability of the storage solution. Additionally, its 48-TSOP package ensures compatibility with standard board layouts, facilitating easier integration into existing systems.

MT29F512G08CFCBBWP-10:B Applications

  • Enterprise Storage Solutions: Ideal for data centers requiring high-density and reliable storage media to handle large volumes of data with fast access times.
  • Industrial Automation: Used in complex industrial systems for logging extensive datasets, ensuring operational data is reliably captured and stored even in harsh conditions.
  • Embedded Systems: Serves as a primary storage component in embedded applications, where its high storage capacity and durability are essential for robust, long-term operation.
  • Telecommunication Infrastructure: Helps manage and store large amounts of data generated by telecom systems, facilitating improved system performance and reliability.
  • Automotive Systems: Supports advanced automotive applications, such as infotainment systems and autonomous driving technologies, requiring high-performance, durable memory storage.
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Shipping Cost

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