MT29F2G08ABAEAWP-E:E

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Mfr.Part #
MT29F2G08ABAEAWP-E:E
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 2GBIT PARALLEL 48TSOP I
Stock
30,612
In Stock :
30,612

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Format :
Flash
Memory Size :
2Gb 256M x 8
Voltage - Supply :
2.7V~3.6V
Memory Type :
Non-Volatile
Packaging :
Tube
Address Bus Width :
29b
Mounting Type :
Surface Mount
Operating Supply Voltage :
3.3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Memory Interface :
Parallel
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Density :
2 GB
Operating Temperature :
0°C~70°C TA
Page Size :
2kB
Introducing Memory Micron Technology MT29F2G08ABAEAWP-E:E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:48-TFSOP (0.724, 18.40mm Width), Operating Temperature:0°C~70°C TA, MT29F2G08ABAEAWP-E:E pinout, MT29F2G08ABAEAWP-E:E datasheet PDF, MT29F2G08ABAEAWP-E:E amp .Beyond Memory Micron Technology MT29F2G08ABAEAWP-E:E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F2G08ABAEAWP-E:E


Memory Micron Technology MT29F2G08ABAEAWP-E:E Overview

Introducing the Memory Micron Technology MT29F2G08ABAEAWP-E:E, a high-performance IC FLASH 2GBit parallel memory solution housed in a 48TSOP package. Designed to meet the increasing demands of sophisticated electronic devices, this product offers a robust blend of capacity, durability, and speed. Manufactured by Micron Technology, a leader in integrated memory technologies, this FLASH memory is ideal for applications requiring fast access and reliable data storage. Its high capacity and compatibility with a broad range of interfaces make it an excellent choice for advanced electronics where space and power efficiency are critical.

MT29F2G08ABAEAWP-E:E Features

This 2Gbit NAND Flash memory offers a parallel interface for higher throughput and lower latency. Key features include high-density storage capability, which allows for extensive data storage without compromising the form factor. The 48TSOP package is engineered for optimal thermal stability and reduced footprint on the PCB. Furthermore, it supports a wide range of operating temperatures, making it suitable for diverse environmental conditions.

MT29F2G08ABAEAWP-E:E Applications

  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and digital cameras for storing operating system data and user-generated content, enhancing device responsiveness and reliability.
  • Embedded Systems: Essential for use in automation systems and IoT devices, where it provides the necessary boot and firmware storage capabilities, facilitating sophisticated device management and connectivity.
  • Automotive: Employed in advanced driver-assistance systems (ADAS) and infotainment systems to manage firmware updates, map data storage, and media content, ensuring smooth performance in dynamic automotive environments.
  • Industrial: Applied in industrial PCs and control systems that require robust and enduring memory solutions capable of operating under extreme conditions without data integrity issues.
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