MT29F1T08EEHAFJ4-3T:A

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Mfr.Part #
MT29F1T08EEHAFJ4-3T:A
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1TB PARALLEL 132VBGA
Stock
41,533
In Stock :
41,533

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Manufacturer :
Micron Technology
Product Category :
Memory
Voltage - Supply :
2.5V~3.6V
Memory Format :
Flash
Memory Interface :
Parallel
Package / Case :
132-VBGA
Clock Frequency :
333MHz
Packaging :
Tray
Mounting Type :
Surface Mount
Memory Size :
1Tb 128G x 8
Memory Type :
Non-Volatile
Operating Temperature :
0°C~70°C TA
Introducing Memory Micron Technology MT29F1T08EEHAFJ4-3T:A from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:132-VBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, MT29F1T08EEHAFJ4-3T:A pinout, MT29F1T08EEHAFJ4-3T:A datasheet PDF, MT29F1T08EEHAFJ4-3T:A amp .Beyond Memory Micron Technology MT29F1T08EEHAFJ4-3T:A ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1T08EEHAFJ4-3T:A


Memory Micron Technology MT29F1T08EEHAFJ4-3T:A Overview

The Memory Micron Technology MT29F1T08EEHAFJ4-3T:A is a state-of-the-art IC FLASH 1TB PARALLEL 132VBGA, designed for high-speed and reliable data storage. Built by the renowned Micron Technology, this integrated circuit offers exceptional storage capacity and performance. Its vast 1TB of storage makes it ideal for applications requiring extensive data handling and retention, enhancing both system efficiency and reliability. Its robust design is specifically engineered to meet the high demands of modern electronic devices and systems.

MT29F1T08EEHAFJ4-3T:A Features

  • 1TB of NAND flash memory
  • Parallel interface for high-speed data transfer
  • Compact 132-ball VFBGA (Very Fine Ball Grid Array) package
  • Enhanced durability and reliability for intensive applications
  • Low power consumption

MT29F1T08EEHAFJ4-3T:A Applications

  • Enterprise Storage Solutions: Ideal for data centers and large-scale storage systems where massive data storage capacity and speed are paramount.
  • High-Performance Computing: Supports high-speed, high-capacity data needs of supercomputing and complex computational tasks.
  • Industrial Applications: Used in industrial-grade equipment requiring long-term reliability and robust data retention under harsh environmental conditions.
  • Embedded Systems: Serves as the core storage module in embedded systems for automotive, IoT, and consumer electronics due to its large capacity and high endurance.
  • Telecommunications Equipment: Essential for managing and storing large volumes of data in telecommunications infrastructure.
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