MPC885VR66

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Ethernet :

10Mbps (3), 10/100Mbps (2)

Surface Mount :

yes

Series :

MPC8xx

ECCN Code :

5A002.A.1

Packaging :

Tray

Base Part Number :

MPC885

Terminal Pitch :

1.27mm

Speed :

66MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Form :

Ball

Integrated Cache :

yes

Terminal Position :

BOTTOM

Power Supplies :

1.83.3V

HTS Code :

8542.31.00.01

Supply Voltage :

1.8V

Co-Processors/DSP :

Communications; CPM, Security; SEC

Boundary Scan :

yes

RoHS Status :

ROHS3 Compliant

Number of Cores/Bus Width :

1 Core 32-Bit

Low Power Mode :

yes

Voltage - I/O :

3.3V

Bit Size :

32

Factory Lead Time :

12 Weeks

Published :

1999

USB :

USB 2.0 (1)

Supply Voltage-Min (Vsup) :

1.7V

Graphics Acceleration :

No

Format :

FIXED POINT

Height Seated (Max) :

2.52mm

JESD-30 Code :

S-PBGA-B357

Supply Voltage-Max (Vsup) :

1.9V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Length :

25mm

External Data Bus Width :

32

Operating Temperature :

0°C~95°C TA

JESD-609 Code :

e1

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Time@Peak Reflow Temperature-Max (s) :

40

Address Bus Width :

32

RAM Controllers :

DRAM

Package / Case :

357-BBGA

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

357

Security Features :

Cryptography