MPC875ZT133

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Voltage - I/O :

3.3V

Series :

MPC8xx

Peak Reflow Temperature (Cel) :

245

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

1.9V

Graphics Acceleration :

No

Number of Cores/Bus Width :

1 Core 32-Bit

Speed :

133MHz

Address Bus Width :

32

External Data Bus Width :

32

Packaging :

Tray

JESD-609 Code :

e0

Factory Lead Time :

12 Weeks

Integrated Cache :

yes

Boundary Scan :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Min (Vsup) :

1.7V

Surface Mount :

yes

Terminal Form :

Ball

Height Seated (Max) :

2.54mm

ECCN Code :

5A002.A.1

Supply Voltage :

1.8V

RAM Controllers :

DRAM

Published :

1999

Co-Processors/DSP :

Communications; CPM, Security; SEC

Number of Terminations :

256

Terminal Pitch :

1.27mm

Length :

23mm

JESD-30 Code :

S-PBGA-B256

RoHS Status :

Non-RoHS Compliant

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Base Part Number :

MPC875

Time@Peak Reflow Temperature-Max (s) :

30

Operating Temperature :

0°C~95°C TA

Terminal Finish :

Tin/Lead (Sn/Pb)

USB :

USB 2.0 (1)

Power Supplies :

1.83.3V

Terminal Position :

BOTTOM

Low Power Mode :

yes

Format :

FIXED POINT

Bit Size :

32

Ethernet :

10Mbps (1), 10/100Mbps (2)

Package / Case :

256-BBGA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Security Features :

Cryptography