MPC860ENZQ80D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of Terminations :

357

Package / Case :

357-BBGA

Boundary Scan :

yes

Integrated Cache :

yes

Terminal Finish :

Tin/Lead (Sn/Pb)

Peak Reflow Temperature (Cel) :

245

Power Supplies :

3.3V

Address Bus Width :

32

Published :

1995

Co-Processors/DSP :

Communications; CPM

RoHS Status :

Non-RoHS Compliant

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

3.465V

Surface Mount :

yes

Format :

FIXED POINT

Graphics Acceleration :

No

Packaging :

Tray

Voltage - I/O :

3.3V

Base Part Number :

MPC860

External Data Bus Width :

32

Speed :

80MHz

Clock Frequency :

50MHz

Supply Voltage-Min (Vsup) :

3.135V

Terminal Pitch :

1.27mm

Ethernet :

10Mbps (4)

Factory Lead Time :

8 Weeks

Supply Voltage :

3.3V

Time@Peak Reflow Temperature-Max (s) :

30

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Number of Cores/Bus Width :

1 Core 32-Bit

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Operating Temperature :

0°C~95°C TA

Height Seated (Max) :

2.52mm

RAM Controllers :

DRAM

Length :

25mm

Terminal Form :

Ball

Series :

MPC8xx

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Position :

BOTTOM

Bit Size :

32

Low Power Mode :

yes

JESD-30 Code :

S-PBGA-B357

ECCN Code :

3A991.A.2

JESD-609 Code :

e0