MPC860ENZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Supply Voltage :

3.3V

Co-Processors/DSP :

Communications; CPM

Bit Size :

32

Height Seated (Max) :

2.52mm

Pbfree Code :

No

Integrated Cache :

yes

Pin Count :

357

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

JESD-30 Code :

S-PBGA-B357

Terminal Position :

BOTTOM

Clock Frequency :

50MHz

Supply Voltage-Min (Vsup) :

3.135V

Address Bus Width :

32

Format :

FIXED POINT

Peak Reflow Temperature (Cel) :

245

Number of Cores/Bus Width :

1 Core 32-Bit

JESD-609 Code :

e0

Number of Terminations :

357

External Data Bus Width :

32

Speed :

50MHz

Packaging :

Tray

Boundary Scan :

yes

Operating Temperature :

0°C~95°C TA

Series :

MPC8xx

Surface Mount :

yes

Graphics Acceleration :

No

Low Power Mode :

yes

Time@Peak Reflow Temperature-Max (s) :

30

RAM Controllers :

DRAM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Qualification Status :

COMMERCIAL

Terminal Finish :

TIN LEAD

Supply Voltage-Max (Vsup) :

3.465V

Terminal Pitch :

1.27mm

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Package / Case :

357-BBGA

Terminal Form :

Ball

Voltage - I/O :

3.3V

Length :

25mm

Ethernet :

10Mbps (4)

RoHS Status :

Non-RoHS Compliant