MPC859TVR133A

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

JESD-30 Code :

S-PBGA-B357

Number of Cores/Bus Width :

1 Core 32-Bit

Supply Voltage-Max (Vsup) :

1.9V

Length :

25mm

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

Number of Terminations :

357

Power Supplies :

1.83.3V

Supply Voltage-Min (Vsup) :

1.7V

Series :

MPC8xx

Operating Temperature :

0°C~95°C TA

Bit Size :

32

Peak Reflow Temperature (Cel) :

245

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

RAM Controllers :

DRAM

Supply Voltage :

1.8V

ECCN Code :

3A991.A.2

Terminal Form :

Ball

Base Part Number :

MPC859

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

External Data Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Factory Lead Time :

8 Weeks

Boundary Scan :

yes

Published :

1999

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Address Bus Width :

32

Voltage - I/O :

3.3V

Terminal Position :

BOTTOM

Low Power Mode :

yes

Package / Case :

357-BBGA

Surface Mount :

yes

Speed :

133MHz

Terminal Pitch :

1.27mm

Format :

FIXED POINT

Graphics Acceleration :

No

Time@Peak Reflow Temperature-Max (s) :

30

Height Seated (Max) :

2.52mm

HTS Code :

8542.31.00.01

Ethernet :

10Mbps (1), 10/100Mbps (1)

JESD-609 Code :

e1

Integrated Cache :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)