MPC859TVR133A

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Supply Voltage-Max (Vsup) :

1.9V

Height Seated (Max) :

2.52mm

JESD-30 Code :

S-PBGA-B357

Series :

MPC8xx

Package / Case :

357-BBGA

Integrated Cache :

yes

Address Bus Width :

32

Base Part Number :

MPC859

RAM Controllers :

DRAM

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage :

1.8V

Power Supplies :

1.83.3V

Terminal Form :

Ball

RoHS Status :

ROHS3 Compliant

Low Power Mode :

yes

Ethernet :

10Mbps (1), 10/100Mbps (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

Peak Reflow Temperature (Cel) :

245

Co-Processors/DSP :

Communications; CPM

ECCN Code :

3A991.A.2

Terminal Pitch :

1.27mm

Published :

1999

Speed :

133MHz

Voltage - I/O :

3.3V

External Data Bus Width :

32

Graphics Acceleration :

No

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code :

8542.31.00.01

Format :

FIXED POINT

Boundary Scan :

yes

Factory Lead Time :

8 Weeks

Number of Cores/Bus Width :

1 Core 32-Bit

Operating Temperature :

0°C~95°C TA

Number of Terminations :

357

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Supply Voltage-Min (Vsup) :

1.7V

Length :

25mm

Bit Size :

32

Terminal Position :

BOTTOM

Surface Mount :

yes

JESD-609 Code :

e1