MPC8555EPXALF

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Pitch :

1mm

USB :

USB 2.0 (1)

Terminal Form :

Ball

Package / Case :

783-BBGA, FCBGA

External Data Bus Width :

64

ECCN Code :

5A002.A.1

Number of Cores/Bus Width :

1 Core 32-Bit

HTS Code :

8542.31.00.01

Length :

29mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage-Min (Vsup) :

1.14V

RAM Controllers :

DDR, SDRAM

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage :

1.2V

Factory Lead Time :

12 Weeks

JESD-30 Code :

S-PBGA-B783

JESD-609 Code :

e0

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Operating Temperature :

0°C~105°C TA

Speed :

667MHz

Co-Processors/DSP :

Communications; CPM, Security; SEC

Series :

MPC85xx

Address Bus Width :

64

Voltage - I/O :

2.5V 3.3V

Format :

Floating Point

Supply Voltage-Max (Vsup) :

1.26V

Height Seated (Max) :

3.75mm

Integrated Cache :

yes

Boundary Scan :

yes

Surface Mount :

yes

Low Power Mode :

yes

Published :

2002

Terminal Finish :

Tin/Lead (Sn/Pb)

Bit Size :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Clock Frequency :

166MHz

Core Processor :

PowerPC e500

Number of Terminations :

783

Graphics Acceleration :

No

Base Part Number :

MPC8555

Packaging :

Tray

RoHS Status :

Non-RoHS Compliant

Peak Reflow Temperature (Cel) :

245

Terminal Position :

BOTTOM

Ethernet :

10/100/1000Mbps (2)

Security Features :

Cryptography, Random Number Generator