MPC850ZQ50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Packaging :

Tray

JESD-609 Code :

e0

Ethernet :

10Mbps (1)

Supply Voltage-Max (Vsup) :

3.6V

Speed :

50MHz

Address Bus Width :

26

Bit Size :

32

Height Seated (Max) :

2.54mm

Number of Terminations :

256

USB :

USB 1.x (1)

ECCN Code :

3A991.A.2

Series :

MPC8xx

HTS Code :

8542.31.00.01

Base Part Number :

MPC850

Terminal Form :

Ball

Peak Reflow Temperature (Cel) :

260

Supply Voltage-Min (Vsup) :

3V

Boundary Scan :

yes

Co-Processors/DSP :

Communications; CPM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PBGA-B256

Operating Temperature :

0°C~95°C TA

Terminal Position :

BOTTOM

Graphics Acceleration :

No

Integrated Cache :

yes

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Low Power Mode :

yes

Terminal Finish :

Tin/Lead/Silver (Sn/Pb/Ag)

Supply Voltage :

3.3V

Terminal Pitch :

1.27mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Format :

FIXED POINT

Voltage - I/O :

3.3V

RAM Controllers :

DRAM

RoHS Status :

Non-RoHS Compliant

External Data Bus Width :

32

Package / Case :

256-BBGA

Time@Peak Reflow Temperature-Max (s) :

40

Number of Cores/Bus Width :

1 Core 32-Bit

Power Supplies :

3.3V

Surface Mount :

yes

Length :

23mm

Published :

1997