MPC850CZQ50BUR2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of Terminations :

256

Low Power Mode :

yes

Ethernet :

10Mbps (1)

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; CPM

Height Seated (Max) :

2.35mm

Address Bus Width :

26

Terminal Position :

BOTTOM

Voltage - I/O :

3.3V

Terminal Form :

Ball

Operating Temperature :

-40°C~95°C TA

Terminal Pitch :

1.27mm

RAM Controllers :

DRAM

Packaging :

Tape and Reel (TR)

Format :

FIXED POINT

RoHS Status :

Non-RoHS Compliant

Base Part Number :

MPC850

Power Supplies :

3.3V

Boundary Scan :

yes

ECCN Code :

3A991.A.2

Speed :

50MHz

USB :

USB 1.x (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

256-BBGA

JESD-609 Code :

e0

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage-Max (Vsup) :

3.465V

Graphics Acceleration :

No

Peak Reflow Temperature (Cel) :

260

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Supply Voltage :

3.3V

Length :

23mm

JESD-30 Code :

S-PBGA-B256

Bit Size :

32

Clock Frequency :

50MHz

Terminal Finish :

Tin/Lead (Sn/Pb)

Supply Voltage-Min (Vsup) :

3.135V

Series :

MPC8xx

Integrated Cache :

yes

External Data Bus Width :

32

HTS Code :

8542.31.00.01

Published :

1997

Time@Peak Reflow Temperature-Max (s) :

40

Surface Mount :

yes

Factory Lead Time :

12 Weeks