MPC563MZP66R2
- Mfr.Part #
- MPC563MZP66R2
- Manufacturer
- NXP Semiconductors
- Package / Case
- 388-BBGA
- Datasheet
- Download
- Description
- IC MCU 32BIT 512KB FLASH 388PBGA
- Stock
- 2,540
- In Stock :
- 2,540
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Microcontrollers
- Terminal Position :
- BOTTOM
- External Data Bus Width :
- 32
- JESD-609 Code :
- e0
- Published :
- 1999
- JESD-30 Code :
- S-PBGA-B388
- Surface Mount :
- yes
- Packaging :
- Tape and Reel (TR)
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- RoHS Status :
- Non-RoHS Compliant
- Factory Lead Time :
- 14 Weeks
- Power Supplies :
- 2.65V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Core Processor :
- PowerPC
- Package / Case :
- 388-BBGA
- Number of I/O :
- 56
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 2.6V
- Voltage - Supply (Vcc/Vdd) :
- 2.5V~2.7V
- Peripherals :
- POR, PWM, WDT
- Program Memory Type :
- Flash
- PWM Channels :
- No
- Base Part Number :
- MPC563
- Height Seated (Max) :
- 2.55mm
- Oscillator Type :
- External
- Speed :
- 66MHz
- Core Size :
- 32-Bit
- Mounting Type :
- Surface Mount
- ROM (words) :
- 524288
- Number of Terminations :
- 388
- DAC Channels :
- No
- Program Memory Size :
- 512KB 512K x 8
- Peak Reflow Temperature (Cel) :
- 240
- Clock Frequency :
- 20MHz
- Bit Size :
- 32
- Series :
- MPC5xx
- Terminal Form :
- Ball
- Operating Temperature :
- -40°C~125°C TA
- Has ADC :
- No
- Address Bus Width :
- 24
- Supply Voltage-Max (Vsup) :
- 2.7V
- Length :
- 27mm
- Connectivity :
- CANbus, EBI/EMI, SCI, SPI, UART/USART
- HTS Code :
- 8542.31.00.01
- Data Converter :
- A/D 32x10b
- Supply Voltage-Min (Vsup) :
- 2.5V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- ECCN Code :
- 3A991.A.2
- RAM Size :
- 32K x 8
- DMA Channels :
- No
- Terminal Pitch :
- 1mm
- Datasheets
- MPC563MZP66R2

Microcontrollers NXP Semiconductors MPC563MZP66R2 Overview
The Microcontrollers NXP Semiconductors MPC563MZP66R2 is a high-performance, 32-bit MCU designed to meet the demanding needs of advanced automotive and industrial applications. Engineered by NXP Semiconductors, this microcontroller integrates 512KB of flash memory, providing robust storage for complex software applications. Its 388-pin PBGA (Plastic Ball Grid Array) package ensures a compact footprint while allowing for efficient thermal management and reliable connectivity. Tailored for tasks requiring quick processing and multiple functionalities, the MPC563MZP66R2 stands out in its class for versatile and powerful deployment.
MPC563MZP66R2 Features
- 32-bit Power Architecture core for robust processing capabilities.
- 512KB of flash memory, facilitating advanced software application storage and execution.
- High-density 388-pin PBGA packaging for a minimized physical footprint.
- Enhanced modular I/O system for flexible connectivity and expansion options.
- Built-in support for CAN, SPI, and Ethernet, enhancing networking capabilities.
MPC563MZP66R2 Applications
- Automotive Control Systems: Used in engine management and transmission control systems, enhancing vehicle performance and fuel efficiency.
- Industrial Automation: Drives automation controllers for machinery and production lines, optimizing operations and reliability.
- Aerospace Systems: Functions in avionics for control and navigational support, ensuring precise and safe operations.
- Medical Devices: Powers monitoring systems in medical applications, providing reliable and fast data processing for critical healthcare equipment.
- Consumer Electronics: Integrated into smart home devices, allowing for enhanced user interface and connectivity.
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