MPC555LFCZP40

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Core Size :

32-Bit

Terminal Finish :

Tin/Lead (Sn/Pb)

Program Memory Size :

448KB 448K x 8

JESD-609 Code :

e0

Data Converter :

A/D 32x10b

Number of Terminations :

272

Height Seated (Max) :

2.65mm

Published :

1998

Peripherals :

POR, PWM, WDT

Terminal Position :

BOTTOM

Time@Peak Reflow Temperature-Max (s) :

30

Peak Reflow Temperature (Cel) :

235

Factory Lead Time :

10 Weeks

Package / Case :

272-BBGA

External Data Bus Width :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

27mm

Program Memory Type :

Flash

Operating Temperature :

-40°C~85°C TA

Bit Size :

32

Width :

27mm

Packaging :

Tray

DAC Channels :

No

Qualification Status :

Not Qualified

Supply Voltage :

3.3V

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Clock Frequency :

20MHz

Mounting Type :

Surface Mount

ECCN Code :

3A991.A.2

Oscillator Type :

External

Speed :

40MHz

Core Processor :

PowerPC

Additional Feature :

ALSO REQUIRES 5V SUPPLY

Surface Mount :

yes

DMA Channels :

No

Supply Voltage-Min (Vsup) :

3V

HTS Code :

8542.31.00.01

Has ADC :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

RAM Size :

26K x 8

Series :

MPC5xx

RoHS Status :

Non-RoHS Compliant

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B272

Connectivity :

CANbus, EBI/EMI, SCI, SPI, UART/USART

Number of I/O :

101

Base Part Number :

MPC555

Address Bus Width :

24

PWM Channels :

yes

Terminal Pitch :

1.27mm

Supply Voltage-Max (Vsup) :

3.6V