MK66FN2M0VMD18

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Form :

Ball

HTS Code :

8542.31.00.01

Number of Terminations :

144

Terminal Pitch :

1mm

JESD-30 Code :

S-PBGA-B144

Core Size :

32-Bit

Data Converter :

A/D 2x16b; D/A 2x12b

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Bit Size :

32

PWM Channels :

yes

Mounting Type :

Surface Mount

Qualification Status :

Not Qualified

Package / Case :

144-LBGA

Number of I/O :

100

DAC Channels :

yes

DMA Channels :

yes

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

RAM Size :

256K x 8

Series :

Kinetis K60

Supply Voltage :

3.3V

Terminal Position :

BOTTOM

Factory Lead Time :

13 Weeks

RAM (bytes) :

262144

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

ROM (words) :

2097152

Core Processor :

ARM® Cortex®-M4

Power Supplies :

1.8/3.3V

Supply Voltage-Min (Vsup) :

1.71V

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Oscillator Type :

Internal

Clock Frequency :

50MHz

Program Memory Type :

Flash

Published :

2002

Program Memory Size :

2MB 2M x 8

Length :

13mm

Packaging :

Tray

Supply Current-Max :

115.08mA

Supply Voltage-Max (Vsup) :

3.6V

Speed :

180MHz

Has ADC :

yes

Surface Mount :

yes

Width :

13mm

ECCN Code :

3A991.A.2

CPU Family :

CORTEX-M4F

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Operating Temperature :

-40°C~105°C TA

RoHS Status :

ROHS3 Compliant