MK53DN512ZCMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RAM Size :

128K x 8

Speed :

100MHz

Operating Temperature :

-40°C~85°C TA

Number of Terminations :

144

Has ADC :

yes

Number of I/O :

94

Peak Reflow Temperature (Cel) :

260

Packaging :

Tray

Published :

2013

Bit Size :

32

Terminal Position :

BOTTOM

RoHS Status :

ROHS3 Compliant

HTS Code :

8542.31.00.01

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Series :

Kinetis K50

DAC Channels :

yes

Oscillator Type :

Internal

PWM Channels :

yes

Data Converter :

A/D 41x16b; D/A 2x12b

Program Memory Type :

Flash

Qualification Status :

Not Qualified

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Core Size :

32-Bit

Height Seated (Max) :

1.7mm

Time@Peak Reflow Temperature-Max (s) :

40

Package / Case :

144-LBGA

JESD-609 Code :

e1

DMA Channels :

yes

ECCN Code :

3A991.A.2

Supply Voltage-Max (Vsup) :

3.6V

Supply Voltage :

3.3V

Program Memory Size :

512KB 512K x 8

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Connectivity :

EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Supply Voltage-Min (Vsup) :

1.71V

Width :

13mm

Clock Frequency :

32MHz

JESD-30 Code :

S-PBGA-B144

Terminal Form :

Ball

Core Processor :

ARM® Cortex®-M4

Surface Mount :

yes

Terminal Finish :

TIN SILVER COPPER

Peripherals :

DMA, I2S, PWM, WDT

Terminal Pitch :

0.5mm

Length :

13mm

Base Part Number :

MK53DN512