MK53DN512ZCMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B144

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Program Memory Size :

512KB 512K x 8

Base Part Number :

MK53DN512

Terminal Position :

BOTTOM

JESD-609 Code :

e1

Time@Peak Reflow Temperature-Max (s) :

40

Number of Terminations :

144

RoHS Status :

ROHS3 Compliant

Program Memory Type :

Flash

Published :

2013

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage :

3.3V

HTS Code :

8542.31.00.01

Oscillator Type :

Internal

Has ADC :

yes

Peripherals :

DMA, I2S, PWM, WDT

Core Size :

32-Bit

Packaging :

Tray

Mounting Type :

Surface Mount

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

1.71V

Bit Size :

32

Package / Case :

144-LBGA

ECCN Code :

3A991.A.2

Supply Voltage-Max (Vsup) :

3.6V

Operating Temperature :

-40°C~85°C TA

Terminal Pitch :

0.5mm

Clock Frequency :

32MHz

DAC Channels :

yes

DMA Channels :

yes

Qualification Status :

Not Qualified

Speed :

100MHz

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Series :

Kinetis K50

PWM Channels :

yes

Width :

13mm

Height Seated (Max) :

1.7mm

RAM Size :

128K x 8

Connectivity :

EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Core Processor :

ARM® Cortex®-M4

Peak Reflow Temperature (Cel) :

260

Terminal Finish :

TIN SILVER COPPER

Data Converter :

A/D 41x16b; D/A 2x12b

Length :

13mm

Number of I/O :

94