MK52DN512CMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

ECCN Code :

3A991.A.2

Mounting Type :

Surface Mount

Speed :

100MHz

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Factory Lead Time :

13 Weeks

Connectivity :

EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Data Converter :

A/D 41x16b; D/A 2x12b

Number of I/O :

96

Supply Voltage-Min (Vsup) :

1.71V

Program Memory Size :

512KB 512K x 8

Bit Size :

32

Package / Case :

144-LBGA

Has ADC :

yes

Operating Temperature :

-40°C~85°C TA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

ROM (words) :

524288

Time@Peak Reflow Temperature-Max (s) :

40

JESD-609 Code :

e1

DAC Channels :

yes

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

3.6V

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Terminal Form :

Ball

Supply Voltage :

3.3V

DMA Channels :

yes

Terminal Position :

BOTTOM

PWM Channels :

yes

Program Memory Type :

Flash

RAM Size :

128K x 8

Terminal Pitch :

1mm

Packaging :

Tray

Clock Frequency :

50MHz

Core Size :

32-Bit

Number of Terminations :

144

Peak Reflow Temperature (Cel) :

260

Terminal Finish :

TIN SILVER COPPER

JESD-30 Code :

S-PBGA-B144

Length :

13mm

Base Part Number :

MK52DN512

Power Supplies :

1.8/3.3V

Published :

2011

Qualification Status :

Not Qualified

CPU Family :

CORTEX-M4

Oscillator Type :

Internal

Series :

Kinetis K50

Core Processor :

ARM® Cortex®-M4

Width :

13mm