MDF7C-20DP-2.54DSA(55)

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Mfr.Part #
MDF7C-20DP-2.54DSA(55)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN HDR 20POS 0.1 STACK T/H TIN
Stock
46,490
In Stock :
46,490

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Manufacturer :
Hirose
Product Category :
Board Spacers, Stackers (Board to Board)
Number of Rows :
2
Length - Post (Mating) :
0.118 3.000mm
Length - Stack Height :
0.728 18.500mm
Packaging :
Bulk
Mount :
Through Hole
Length :
24.9936mm
Termination :
Solder
Series :
MDF7
Contact Finish - Post (Mating) :
Tin
Length - Overall Pin :
0.984 25.000mm
Contact Plating :
Tin
Number of Pins :
20
Pitch :
0.100 2.54mm
RoHS Status :
RoHS Compliant
Mounting Type :
Through Hole
Length - Tail :
0.138 3.500mm
Factory Lead Time :
10 Weeks
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Row Spacing :
0.100 (2.54mm)
Number of Positions :
20
Color :
Black, Gray
Introducing Board Spacers, Stackers (Board to Board) Hirose MDF7C-20DP-2.54DSA(55) from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:20, Mounting Type:Through Hole, MDF7C-20DP-2.54DSA(55) pinout, MDF7C-20DP-2.54DSA(55) datasheet PDF, MDF7C-20DP-2.54DSA(55) amp .Beyond Board Spacers, Stackers (Board to Board) Hirose MDF7C-20DP-2.54DSA(55) ,we also offer ZW-01-09-S-S-425-200, TW-02-02-T-S-200-088, ZW-03-15-T-S-315-158, Our vast inventory has you covered. Contact us now for immediate solutions.



MDF7 Series 2 Rows Solder 0.100 2.54mm Bulk Through Hole 20 Positions Black, Gray

MDF7C-20DP-2.54DSA(55) Overview


The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the MDF7 Series, it belongs to the range of products of that series.20 pins are on the device.

MDF7C-20DP-2.54DSA(55) Features


MDF7 series


MDF7C-20DP-2.54DSA(55) Applications


There are a lot of Hirose Electric Co Ltd
MDF7C-20DP-2.54DSA(55) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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