MCZ33897TEF

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Mfr.Part #
MCZ33897TEF
Manufacturer
NXP Semiconductors
Package / Case
14-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
TRANSCEIVER, PHYSICAL LAYER, SIN
Stock
7,728
In Stock :
7,728

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Manufacturer :
NXP Semiconductors
Product Category :
Buffers, Drivers, Receivers, Transceivers
Width :
3.9mm
Peak Reflow Temperature (Cel) :
260
Protocol :
CANbus
JESD-30 Code :
R-PDSO-G14
Packaging :
Tube
Type :
Transceiver
Base Part Number :
MCZ33897
Time@Peak Reflow Temperature-Max (s) :
40
Receiver Hysteresis :
500mV
Length :
8.65mm
Data Rate :
83.33Kbps
Number of Transceivers :
1
Published :
2003
Package / Case :
14-SOIC (0.154, 3.90mm Width)
Mounting Type :
Surface Mount
Terminal Form :
Gull wing
Terminal Position :
Dual
JESD-609 Code :
e3
Number of Functions :
1
Terminal Pitch :
1.27mm
Qualification Status :
Not Qualified
Operating Temperature :
-40°C~125°C
Factory Lead Time :
12 Weeks
Power Supplies :
6/26V
HTS Code :
8542.39.00.01
Number of Drivers/Receivers :
1/1
Duplex :
Half
Terminal Finish :
Matte Tin (Sn)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Surface Mount :
yes
Height Seated (Max) :
1.75mm
Voltage - Supply :
12V
Number of Terminations :
14
Datasheets
MCZ33897TEF
Introducing Buffers, Drivers, Receivers, Transceivers NXP Semiconductors MCZ33897TEF from Chip IC,where excellence meets affordability. This product stands out with its Type:Transceiver, Base Part Number:MCZ33897, Package / Case:14-SOIC (0.154, 3.90mm Width), Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C, Number of Terminations:14, MCZ33897TEF pinout, MCZ33897TEF datasheet PDF, MCZ33897TEF amp .Beyond Buffers, Drivers, Receivers, Transceivers NXP Semiconductors MCZ33897TEF ,we also offer SN74LVC244APWR, SN74AUP1G07DCKR, SN74LVC2G125DCUR, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MCZ33897TEF


Buffers, Drivers, Receivers, Transceivers - NXP Semiconductors MCZ33897TEF Overview

The NXP Semiconductors MCZ33897TEF is a highly efficient transceiver designed to facilitate seamless communication within automotive networks. With its advanced physical layer capabilities, this transceiver ensures reliable data transmission, making it an indispensable component in modern automotive systems.

Featuring robust construction and cutting-edge technology, the MCZ33897TEF offers unparalleled performance and durability, meeting the stringent requirements of the automotive industry. Its compact design and low power consumption make it ideal for integration into a wide range of automotive applications, enhancing overall system efficiency and reliability.

MCZ33897TEF Features

  • Highly efficient transceiver
  • Advanced physical layer capabilities
  • Robust construction for durability
  • Compact design
  • Low power consumption
  • Designed for automotive applications

MCZ33897TEF Applications

  • Automotive control systems: The MCZ33897TEF is used in automotive control units to facilitate communication between various subsystems, such as engine control modules, transmission control modules, and body control modules. Its reliable data transmission ensures seamless operation of these critical systems, enhancing vehicle performance and safety.
  • Body electronics: In automotive body electronics, the MCZ33897TEF enables communication between components such as door modules, window lift modules, and climate control units. Its compact design allows for easy integration into space-constrained environments, while its low power consumption contributes to overall energy efficiency.
  • Infotainment systems: The MCZ33897TEF plays a vital role in enabling communication within automotive infotainment systems, allowing for seamless connectivity between head units, amplifiers, and speakers. Its advanced physical layer capabilities ensure high-quality audio and data transmission, enhancing the overall multimedia experience for vehicle occupants.
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Shipping Cost

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