MCP6061-E/SN

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Mfr.Part #
MCP6061-E/SN
Manufacturer
Microchip Technology
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC OPAMP GP 1 CIRCUIT 8SOIC
Stock
8,239
In Stock :
8,239

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Manufacturer :
Microchip Technology
Product Category :
Instrumentation, OP Amps, Buffer Amps
Number of Terminals :
8
Peak Reflow Temperature (Cel) :
260
Packaging :
Tube
Output Current per Channel :
27 mA
Seated Height-Max :
1.75 mm
Mounting :
Surface Mount
Surface Mount :
yes
Product Status :
Active
Number of Circuits :
1
Lifecycle Status :
Production (Last Updated: 2 years ago)
Common Mode Rejection Ratio :
72 dB
Max Operating Temperature :
125 °C
Length :
4.8768mm
Voltage Gain-Min :
56200
JESD-609 Code :
e3
Qualification :
AEC-Q100
Package :
Tube
Product Type :
Precision Amplifiers
Amplifier Type :
GENERAL PURPOSE
Supplier Device Package :
8-SOIC
REACH SVHC :
No SVHC
Operating Supply Voltage :
5.5, 2.375, 4.5 V
Lead Free :
Lead Free
Architecture :
VOLTAGE-FEEDBACK
Wideband :
No
Voltage Gain dB :
115 dB
Supply Type :
Single
Shut Down Support :
No
Supply Voltage :
3V
Number of Functions :
1
Qualification Status :
Not Qualified
Base Product Number :
MCP6061
Time@Peak Reflow Temperature-Max (s) :
40
Average Bias Current-Max (IIB) :
0.005μA
Supply Voltage Limit-Max :
7V
ECCN Code :
EAR99
Voltage - Supply, Single/Dual (±) :
1.8V~6V
Schedule B :
8542330000, 8542330000/8542330000/8542330000/8542330000/8542330000
RoHS Status :
ROHS3 Compliant
Pbfree Code :
yes
Output Current :
27mA
Published :
2000
Shutdown :
No Shutdown
Max Supply Voltage :
6 V
Slew Rate :
0.25V/µs
Terminal Pitch :
1.27 mm
Input Offset Voltage-Max :
150 µV
Terminal Position :
Dual
Operating Supply Current :
60 uA
Mounting Type :
Surface Mount
Low-Offset :
yes
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Maximum Operating Temperature :
+ 125 C
Current - Supply :
60μA
Power Supply Type :
Single
Pin Count :
8
JESD-30 Code :
R-PDSO-G8
Output Type :
Rail-to-Rail
Package Shape :
RECTANGULAR
Product Category :
Precision Amplifiers
Product :
Precision Amplifiers
Min Operating Temperature :
-40 °C
Voltage Gain :
115dB
Number of Pins :
8
Width :
3.9116mm
Number of Channels :
1
Low-Bias :
yes
Supplier Package :
SOIC N
Gain Bandwidth Product :
730kHz
Mounting Style :
SMD/SMT
Factory Lead Time :
21 Weeks
Series :
--
HTS Code :
8542.33.00.01
Bias Current-Max (IIB) @25C :
0.0001 µA
Input Offset Voltage (Vos) :
150μV
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Bandwidth :
730 kHz
Number of Terminations :
8
Frequency Compensation :
yes
Mount :
Surface Mount
Terminal Finish :
Matte Tin (Sn) - annealed
Manufacturer :
Microchip
Operating Temperature :
-40°C~125°C
Supply Current-Max :
0.09 mA
Programmable Power :
No
Number of Channels per Chip :
1
Brand :
Microchip Technology / Atmel
Unity Gain BW-Nom :
730 kHz
Temperature Grade :
Automotive
Terminal Form :
Gull wing
Height :
1.2446mm
Radiation Hardening :
No
Reach Compliance Code :
Compliant
Nominal Supply Current :
60μA
Minimum Operating Temperature :
- 40 C
Input Bias Current :
100 pA
Number of Amplifiers :
1
Screening Level :
Extended
Type :
General Purpose Amplifier
Power :
No
Voltage - Input Offset :
150μV
Current - Input Bias :
1pA
Min Supply Voltage :
1.8 V
RoHS :
Details
Base Part Number :
MCP6061
Power Supply Rejection Ratio (PSRR) :
70dB
Micropower :
yes
Power Supplies :
2/5V
Number of Elements :
1
Introducing Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP6061-E/SN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:8-SOIC (0.154, 3.90mm Width), Number of Pins:8, Number of Channels:1, Bandwidth:730 kHz, Number of Terminations:8, Operating Temperature:-40°C~125°C, Type:General Purpose Amplifier, Base Part Number:MCP6061, MCP6061-E/SN pinout, MCP6061-E/SN datasheet PDF, MCP6061-E/SN amp .Beyond Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP6061-E/SN ,we also offer OP07CDR, TS321CX5 RFG, NE5532ADR, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MCP6061-E/SN


Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP6061-E/SN Overview

The Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP6061-E/SN is a high-performance integrated circuit operational amplifier designed to meet the demanding requirements of precision instrumentation, sensor signal conditioning, and signal amplification applications. Manufactured by Microchip Technology, a trusted leader in the semiconductor industry, this IC offers exceptional performance, reliability, and versatility.

Featuring a single op-amp configuration, the MCP6061-E/SN provides a cost-effective solution for applications requiring high input impedance, low input offset voltage, and rail-to-rail input/output operation. With its wide supply voltage range and low power consumption, this device is suitable for a wide range of industrial, medical, and consumer electronics applications.

Whether you are designing precision measurement instruments, sensor interfaces, or signal conditioning circuits, the MCP6061-E/SN delivers the performance and flexibility required to meet the most demanding application requirements.

MCP6061-E/SN Features

  • Single op-amp configuration
  • Wide supply voltage range
  • Low input offset voltage
  • High input impedance
  • Rail-to-rail input/output operation
  • Low power consumption
  • High common-mode rejection ratio (CMRR)
  • Small outline integrated circuit (SOIC) package

MCP6061-E/SN Applications

  • Industrial Automation: The MCP6061-E/SN is ideal for precision instrumentation and control systems, providing accurate signal amplification and conditioning for sensor interfaces and process control applications.
  • Medical Devices: In medical equipment such as patient monitoring devices and diagnostic instruments, the MCP6061-E/SN ensures reliable and accurate signal processing, contributing to the overall performance and reliability of the system.
  • Consumer Electronics: From portable electronic devices to audio amplifiers, the MCP6061-E/SN offers high-performance signal amplification in a compact and energy-efficient package, making it suitable for a wide range of consumer electronics applications.
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