MCP23S09-E/SO

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Mfr.Part #
MCP23S09-E/SO
Manufacturer
Microchip Technology
Package / Case
18-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC I/O EXPANDER SPI 8B 18SOIC
Stock
1,008
In Stock :
1,008

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Manufacturer :
Microchip Technology
Product Category :
I/O Expanders
Frequency :
10 MHz
Max Operating Temperature :
125 °C
Terminal Form :
Gull wing
Number of Channels :
1
Number of Bits :
8
Operating Temperature :
-40°C~125°C
Operating Supply Voltage :
1.8 V to 5.5 V
ESD Protection :
4 kV
Temperature Grade :
Automotive
Lead Free :
Lead Free
Packaging :
Tube
Base Part Number :
MCP23S09
Terminal Finish :
Matte Tin (Sn) - annealed
Terminal Pitch :
1.27 mm
MSL :
MSL 1 - Unlimited
Screening Level :
Extended
Min Operating Temperature :
-40 °C
Seated Height-Max :
2.65 mm
Product Category :
Interface - I/O Expanders
Output Voltage :
1.8 V to 4.5 V
RoHS :
Compliant
Number of I/Os :
8
Number of Pins :
18
Maximum Operating Temperature :
+ 125 C
Features :
--
Package :
Tube
Brand :
Microchip Technology / Atmel
Product Type :
I/O Expanders
Interface Type :
Serial, SPI
REACH SVHC :
No SVHC
Mount :
Surface Mount
Pbfree Code :
yes
Number of Ports :
1
Output Type :
Open Drain
Qualification Status :
Not Qualified
Max Frequency :
3.4 MHz
Chip Configuration :
8bit
Package Type :
SOIC
Nominal Supply Current :
1mA
uPs/uCs/Peripheral ICs Type :
PARALLEL IO PORT, GENERAL PURPOSE
Surface Mount :
yes
Base Product Number :
MCP23S09
Supplier Package :
SOIC W
Number of Terminals :
18
Current - Output Source/Sink :
25mA
Product :
I/O Expanders
JESD-30 Code :
R-PDSO-G18
Type :
I/O Expander
Pin Count :
18
Clock Frequency :
10MHz
Power Dissipation :
700mW
Input Voltage :
1.8 V to 5.5 V
Mounting Style :
SMD/SMT
Interface :
SPI
ECCN Code :
EAR99
HTS Code :
8542.39.00.01
Output Current :
25mA
Number of I/O :
8
JESD-609 Code :
e3
Logic Type :
I/O Expander
Contact Plating :
Tin
Series :
--
Width :
7.5mm
Max Supply Voltage :
5.5 V
Reach Compliance Code :
Compliant
Category :
I/O Expander
Peak Reflow Temperature (Cel) :
260
Factory Lead Time :
6 Weeks
Number of Terminations :
18
Package / Case :
18-SOIC (0.295, 7.50mm Width)
Supplier Device Package :
18-SOIC
Product Status :
Active
Power Supplies :
2/5V
Voltage - Supply :
1.8V~5.5V
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Interrupt Output :
yes
Lifecycle Status :
Production (Last Updated: 2 years ago)
Logic Family :
MCP23S09
Manufacturer :
Microchip
Mounting Type :
Surface Mount
Terminal Position :
Dual
Length :
11.55 mm
Height Seated (Max) :
2.65mm
Mounting :
Surface Mount
Min Supply Voltage :
1.8 V
Minimum Operating Temperature :
- 40 C
Supply Voltage :
5V
Number of I/O Lines :
8
Package Shape :
RECTANGULAR
Time@Peak Reflow Temperature-Max (s) :
40
RoHS Status :
ROHS3 Compliant
Datasheets
MCP23S09-E/SO
Introducing I/O Expanders Microchip Technology MCP23S09-E/SO from Chip IC,where excellence meets affordability. This product stands out with its Number of Channels:1, Operating Temperature:-40°C~125°C, Base Part Number:MCP23S09, Number of Pins:18, Type:I/O Expander, Number of Terminations:18, Package / Case:18-SOIC (0.295, 7.50mm Width), Mounting Type:Surface Mount, MCP23S09-E/SO pinout, MCP23S09-E/SO datasheet PDF, MCP23S09-E/SO amp .Beyond I/O Expanders Microchip Technology MCP23S09-E/SO ,we also offer XRA1405IL24-F, CY8C9520A-24PVXIT, MAX7315AUE+, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MCP23S09-E/SO


[I/O Expanders Microchip Technology MCP23S09-E/SO] Overview

Introducing the cutting-edge I/O expander from Microchip Technology, the MCP23S09-E/SO. This innovative integrated circuit is designed to enhance your electronic systems by providing seamless expansion of input/output capabilities. With its SPI interface and 8-bit configuration, the MCP23S09-E/SO offers unparalleled versatility and performance.

Whether you're a seasoned electronics enthusiast or a professional in the industry, this I/O expander is engineered to meet your demands for flexibility, reliability, and efficiency. Experience the power of expanded I/O functionality with the MCP23S09-E/SO.

[MCP23S09-E/SO] Features

  • Highly integrated SPI interface for seamless communication
  • 8-bit configuration for precise control over I/O operations
  • Compact and durable 18SOIC package for easy integration into any design
  • Wide operating voltage range for compatibility with various systems
  • Low power consumption for energy-efficient performance
  • Robust design with built-in protection features for enhanced reliability

[MCP23S09-E/SO] Applications

  • Home Automation Systems: Implement the MCP23S09-E/SO in smart home devices such as lighting controls and sensor interfaces, enabling seamless integration and intelligent control.
  • Industrial Automation: Enhance industrial control systems with expanded I/O capabilities, allowing for efficient monitoring and management of equipment and processes.
  • Embedded Systems: Integrate the MCP23S09-E/SO into embedded applications such as robotics and IoT devices to extend I/O functionality and optimize performance.
  • Consumer Electronics: Incorporate the MCP23S09-E/SO into consumer electronics products like gaming consoles and home entertainment systems for enhanced connectivity and control options.
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