MCP23S09-E/SO

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Mfr.Part #
MCP23S09-E/SO
Manufacturer
Microchip Technology
Package / Case
18-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC I/O EXPANDER SPI 8B 18SOIC
Stock
1,008
In Stock :
1,008

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Manufacturer :
Microchip Technology
Product Category :
I/O Expanders
Number of I/O Lines :
8
Power Dissipation :
700mW
Mount :
Surface Mount
HTS Code :
8542.39.00.01
MSL :
MSL 1 - Unlimited
Packaging :
Tube
Package :
Tube
Output Type :
Open Drain
Max Supply Voltage :
5.5 V
Power Supplies :
2/5V
Reach Compliance Code :
Compliant
Terminal Pitch :
1.27 mm
ESD Protection :
4 kV
Minimum Operating Temperature :
- 40 C
Lead Free :
Lead Free
Output Voltage :
1.8 V to 4.5 V
Clock Frequency :
10MHz
Output Current :
25mA
Package Type :
SOIC
Input Voltage :
1.8 V to 5.5 V
Supplier Device Package :
18-SOIC
Mounting :
Surface Mount
Product Status :
Active
Mounting Type :
Surface Mount
Nominal Supply Current :
1mA
Terminal Form :
Gull wing
Interrupt Output :
yes
RoHS :
Compliant
Operating Supply Voltage :
1.8 V to 5.5 V
Terminal Finish :
Matte Tin (Sn) - annealed
Product Type :
I/O Expanders
Mounting Style :
SMD/SMT
REACH SVHC :
No SVHC
Maximum Operating Temperature :
+ 125 C
Min Supply Voltage :
1.8 V
Number of Pins :
18
Number of Terminals :
18
Features :
--
Chip Configuration :
8bit
JESD-609 Code :
e3
Factory Lead Time :
6 Weeks
uPs/uCs/Peripheral ICs Type :
PARALLEL IO PORT, GENERAL PURPOSE
ECCN Code :
EAR99
Logic Type :
I/O Expander
Screening Level :
Extended
Interface Type :
Serial, SPI
Terminal Position :
Dual
Package Shape :
RECTANGULAR
Base Part Number :
MCP23S09
Contact Plating :
Tin
Brand :
Microchip Technology / Atmel
Voltage - Supply :
1.8V~5.5V
Min Operating Temperature :
-40 °C
RoHS Status :
ROHS3 Compliant
Pin Count :
18
Number of I/Os :
8
Frequency :
10 MHz
Time@Peak Reflow Temperature-Max (s) :
40
Seated Height-Max :
2.65 mm
Supply Voltage :
5V
Lifecycle Status :
Production (Last Updated: 2 years ago)
Height Seated (Max) :
2.65mm
Manufacturer :
Microchip
Operating Temperature :
-40°C~125°C
Package / Case :
18-SOIC (0.295, 7.50mm Width)
Supplier Package :
SOIC W
Peak Reflow Temperature (Cel) :
260
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Category :
I/O Expander
Product Category :
Interface - I/O Expanders
Length :
11.55 mm
Number of Ports :
1
Interface :
SPI
Pbfree Code :
yes
Number of Channels :
1
Series :
--
Max Operating Temperature :
125 °C
Qualification Status :
Not Qualified
Number of Bits :
8
Surface Mount :
yes
Type :
I/O Expander
Number of Terminations :
18
Temperature Grade :
Automotive
Product :
I/O Expanders
JESD-30 Code :
R-PDSO-G18
Base Product Number :
MCP23S09
Width :
7.5mm
Number of I/O :
8
Current - Output Source/Sink :
25mA
Logic Family :
MCP23S09
Max Frequency :
3.4 MHz
Datasheets
MCP23S09-E/SO
Introducing I/O Expanders Microchip Technology MCP23S09-E/SO from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:18, Base Part Number:MCP23S09, Operating Temperature:-40°C~125°C, Package / Case:18-SOIC (0.295, 7.50mm Width), Number of Channels:1, Type:I/O Expander, Number of Terminations:18, MCP23S09-E/SO pinout, MCP23S09-E/SO datasheet PDF, MCP23S09-E/SO amp .Beyond I/O Expanders Microchip Technology MCP23S09-E/SO ,we also offer XRA1405IL24-F, CY8C9520A-24PVXIT, MAX7315AUE+, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MCP23S09-E/SO


[I/O Expanders Microchip Technology MCP23S09-E/SO] Overview

Introducing the cutting-edge I/O expander from Microchip Technology, the MCP23S09-E/SO. This innovative integrated circuit is designed to enhance your electronic systems by providing seamless expansion of input/output capabilities. With its SPI interface and 8-bit configuration, the MCP23S09-E/SO offers unparalleled versatility and performance.

Whether you're a seasoned electronics enthusiast or a professional in the industry, this I/O expander is engineered to meet your demands for flexibility, reliability, and efficiency. Experience the power of expanded I/O functionality with the MCP23S09-E/SO.

[MCP23S09-E/SO] Features

  • Highly integrated SPI interface for seamless communication
  • 8-bit configuration for precise control over I/O operations
  • Compact and durable 18SOIC package for easy integration into any design
  • Wide operating voltage range for compatibility with various systems
  • Low power consumption for energy-efficient performance
  • Robust design with built-in protection features for enhanced reliability

[MCP23S09-E/SO] Applications

  • Home Automation Systems: Implement the MCP23S09-E/SO in smart home devices such as lighting controls and sensor interfaces, enabling seamless integration and intelligent control.
  • Industrial Automation: Enhance industrial control systems with expanded I/O capabilities, allowing for efficient monitoring and management of equipment and processes.
  • Embedded Systems: Integrate the MCP23S09-E/SO into embedded applications such as robotics and IoT devices to extend I/O functionality and optimize performance.
  • Consumer Electronics: Incorporate the MCP23S09-E/SO into consumer electronics products like gaming consoles and home entertainment systems for enhanced connectivity and control options.
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