MCP2003BT-E/MF
- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock :
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Width :
- 3mm
- Base Part Number :
- MCP2003
- Number of Terminations :
- 8
- Supply Voltage :
- 12V
- Mounting Type :
- Surface Mount
- Pin Count :
- 8
- Supplier Device Package :
- 8-DFN (3x3)
- Product Type :
- LIN Transceivers
- Product Category :
- LIN Transceivers
- Terminal Position :
- Dual
- Number of Drivers/Receivers :
- 1/1
- Surface Mount :
- yes
- Product Status :
- Active
- Protocols Supported :
- SO 17987/SAE J2602
- Supplier Package :
- DFN
- Operating Supply Current :
- 160 uA
- Manufacturer :
- Microchip
- Number of Transmitters :
- 1
- Subcategory :
- Interface ICs
- Base Product Number :
- MCP2003
- HTS Code :
- 8542.39.00.01
- Package Shape :
- Square
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Operating Supply Voltage :
- 5.5, 30 V
- RoHS :
- Details
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Height Seated (Max) :
- 1mm
- ECCN Code :
- EAR99
- RoHS Status :
- ROHS3 Compliant
- Transmit Delay-Max :
- 4000 ns
- Brand :
- Microchip Technology
- Number of Terminals :
- 8
- Series :
- --
- Terminal Form :
- NO LEAD
- JESD-609 Code :
- e3
- Terminal Pitch :
- 0.65mm
- Type :
- Transceiver
- Data Rate :
- 20kBaud
- Maximum Data Rate :
- 20 KBd
- Factory Lead Time :
- 8 Weeks
- Seated Height-Max :
- 1 mm
- Duplex :
- Half
- Number of Receivers :
- 1
- Package / Case :
- 8-VDFN Exposed Pad
- JESD-30 Code :
- S-PDSO-N8
- Receive Delay-Max :
- 6000 ns
- Driver Number of Bits :
- 1
- Packaging :
- Tape and Reel (TR)
- Interface Standard :
- ISO 17987; ISO 7637
- Differential Output :
- No
- Receiver Number of Bits :
- 1
- Mount :
- Surface Mount
- Temperature Grade :
- Automotive
- Mounting :
- Surface Mount
- Protocol :
- LINbus
- Input Characteristics :
- Schmitt Trigger
- Length :
- 3mm
- Screening Level :
- TS 16949
- Interface IC Type :
- LINE TRANSCEIVER
- Power Supply Type :
- Single
- Simplex/Duplex :
- Half Duplex
- Published :
- 2016
- Voltage - Supply :
- 5.5V~30V
- Reach Compliance Code :
- Compliant
- Package :
- Tape and Reel (TR)
- Number of Functions :
- 1
- Operating Temperature :
- -40°C~125°C
- Datasheets
- MCP2003BT-E/MF
MCP2003BT-E/MF Documents

Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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