MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Number of Receivers :
- 1
- RoHS :
- Details
- Published :
- 2016
- HTS Code :
- 8542.39.00.01
- Supplier Package :
- DFN
- Differential Output :
- No
- Mounting Type :
- Surface Mount
- Terminal Form :
- NO LEAD
- Power Supply Type :
- Single
- JESD-30 Code :
- S-PDSO-N8
- Product Category :
- LIN Transceivers
- Number of Drivers/Receivers :
- 1/1
- RoHS Status :
- ROHS3 Compliant
- Subcategory :
- Interface ICs
- Duplex :
- Half
- Voltage - Supply :
- 5.5V~30V
- Product Type :
- LIN Transceivers
- Temperature Grade :
- Automotive
- Manufacturer :
- Microchip
- Package :
- Tape and Reel (TR)
- Package Shape :
- Square
- Interface IC Type :
- LINE TRANSCEIVER
- Packaging :
- Tape and Reel (TR)
- Base Part Number :
- MCP2003
- JESD-609 Code :
- e3
- Package / Case :
- 8-VDFN Exposed Pad
- Width :
- 3mm
- Input Characteristics :
- Schmitt Trigger
- Number of Terminals :
- 8
- Mounting :
- Surface Mount
- Simplex/Duplex :
- Half Duplex
- Driver Number of Bits :
- 1
- Terminal Pitch :
- 0.65mm
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Supplier Device Package :
- 8-DFN (3x3)
- Brand :
- Microchip Technology
- Surface Mount :
- yes
- Operating Supply Current :
- 160 uA
- Operating Supply Voltage :
- 5.5, 30 V
- Protocols Supported :
- SO 17987/SAE J2602
- Pin Count :
- 8
- Data Rate :
- 20kBaud
- Number of Terminations :
- 8
- Screening Level :
- TS 16949
- Number of Functions :
- 1
- Protocol :
- LINbus
- Mount :
- Surface Mount
- Terminal Position :
- Dual
- Number of Transmitters :
- 1
- Length :
- 3mm
- ECCN Code :
- EAR99
- Receiver Number of Bits :
- 1
- Seated Height-Max :
- 1 mm
- Factory Lead Time :
- 8 Weeks
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Interface Standard :
- ISO 17987; ISO 7637
- Base Product Number :
- MCP2003
- Transmit Delay-Max :
- 4000 ns
- Height Seated (Max) :
- 1mm
- Reach Compliance Code :
- Compliant
- Type :
- Transceiver
- Operating Temperature :
- -40°C~125°C
- Product Status :
- Active
- Supply Voltage :
- 12V
- Receive Delay-Max :
- 6000 ns
- Series :
- --
- Maximum Data Rate :
- 20 KBd
- Datasheets
- MCP2003BT-E/MF
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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