MCIMX6U4AVM08AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Pitch :

0.8mm

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Operating Temperature :

-40°C~125°C TJ

Time@Peak Reflow Temperature-Max (s) :

40

Factory Lead Time :

15 Weeks

JESD-30 Code :

S-PBGA-B624

External Data Bus Width :

64

Address Bus Width :

16

RoHS Status :

ROHS3 Compliant

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Boundary Scan :

yes

Series :

i.MX6DL

Low Power Mode :

yes

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Graphics Acceleration :

yes

JESD-609 Code :

e1

Format :

FIXED POINT

HTS Code :

8542.31.00.01

Packaging :

Tray

Bit Size :

64

Surface Mount :

yes

ECCN Code :

5A992

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Published :

2002

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

624

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

USB :

USB 2.0 + PHY (4)

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Terminal Form :

Ball

Clock Frequency :

24MHz

Display & Interface Controllers :

Keypad, LCD

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Number of Cores/Bus Width :

2 Core 32-Bit

Height Seated (Max) :

1.6mm

Terminal Position :

BOTTOM

Ethernet :

10/100/1000Mbps (1)

Package / Case :

624-LFBGA

Speed :

800MHz

Integrated Cache :

yes

Length :

21mm

Supply Voltage :

1.35V

Core Processor :

ARM® Cortex®-A9

Supply Voltage-Min (Vsup) :

1.275V

Supply Voltage-Max (Vsup) :

1.5V

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART