MCIMX6L8DVN10AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

HTS Code :

8542.31.00.01

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Core Processor :

ARM® Cortex®-A9

Terminal Position :

BOTTOM

Height Seated (Max) :

1.1mm

Number of Cores/Bus Width :

1 Core 32-Bit

RoHS Status :

ROHS3 Compliant

Terminal Form :

Ball

Additional Interfaces :

AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Length :

13mm

Packaging :

Tray

Terminal Pitch :

0.5mm

USB :

USB 2.0 + PHY (3)

Operating Temperature :

0°C~95°C TJ

JESD-30 Code :

S-PBGA-B

Graphics Acceleration :

yes

Ethernet :

10/100Mbps (1)

Surface Mount :

yes

Peak Reflow Temperature (Cel) :

260

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Factory Lead Time :

12 Weeks

Display & Interface Controllers :

Keypad, LCD

Supply Voltage-Max (Vsup) :

1.5V

Package / Case :

432-TFBGA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Voltage - I/O :

1.2V 1.8V 3.0V

Supply Voltage-Min (Vsup) :

1.375V

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Series :

i.MX6SL

Speed :

1.0GHz