MCF5329CVM240

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Mounting Type :

Surface Mount

Address Bus Width :

24

Height Seated (Max) :

1.6mm

Peak Reflow Temperature (Cel) :

260

Integrated Cache :

yes

Supply Voltage-Min (Vsup) :

1.4V

Terminal Form :

Ball

HTS Code :

8542.31.00.01

JESD-30 Code :

S-PBGA-B256

Qualification Status :

Not Qualified

JESD-609 Code :

e1

ECCN Code :

5A002.A.1

Number of Terminations :

256

Time@Peak Reflow Temperature-Max (s) :

40

Speed :

240MHz

Terminal Pitch :

1mm

Program Memory Type :

ROMless

Width :

17mm

RoHS Status :

ROHS3 Compliant

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Bit Size :

32

Surface Mount :

yes

Base Part Number :

MCF5329

Boundary Scan :

yes

Core Processor :

Coldfire V3

Package / Case :

256-LBGA

Format :

FIXED POINT

Length :

17mm

Supply Voltage-Max (Vsup) :

1.6V

Clock Frequency :

80MHz

Low Power Mode :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage :

1.5V

Peripherals :

DMA, LCD, PWM, WDT

RAM Size :

32K x 8

Number of I/O :

94

Terminal Position :

BOTTOM

Operating Temperature :

-40°C~85°C TA

Series :

MCF532x

Packaging :

Tray

Oscillator Type :

External

Connectivity :

CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG

Voltage - Supply (Vcc/Vdd) :

1.4V~3.6V

Published :

2006

External Data Bus Width :

32

Factory Lead Time :

12 Weeks

Core Size :

32-Bit