MCF5274LCVM166

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Pitch :

1mm

RAM Size :

64K x 8

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Peripherals :

DMA, WDT

Number of I/O :

69

External Data Bus Width :

32

Clock Frequency :

83MHz

Factory Lead Time :

10 Weeks

Address Bus Width :

24

Terminal Form :

Ball

JESD-609 Code :

e1

Packaging :

Tray

Qualification Status :

Not Qualified

Published :

1997

Package / Case :

196-LBGA

Program Memory Type :

ROMless

Core Processor :

Coldfire V2

Supply Voltage :

1.5V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

15mm

Surface Mount :

yes

Bit Size :

32

Base Part Number :

MCF5274

Mounting Type :

Surface Mount

Core Size :

32-Bit

Peak Reflow Temperature (Cel) :

260

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Speed :

166MHz

HTS Code :

8542.31.00.01

JESD-30 Code :

S-PBGA-B196

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Format :

FIXED POINT

Height Seated (Max) :

1.6mm

Supply Voltage-Max (Vsup) :

1.6V

RoHS Status :

ROHS3 Compliant

Number of Terminations :

196

Integrated Cache :

yes

Series :

MCF527x

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Operating Temperature :

-40°C~85°C TA

Width :

15mm

Terminal Position :

BOTTOM

ECCN Code :

5A992

Voltage - Supply (Vcc/Vdd) :

1.4V~1.6V

Low Power Mode :

yes

Boundary Scan :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Oscillator Type :

External

Supply Voltage-Min (Vsup) :

1.4V