MC9S12XEG128MAL

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Program Memory Type :

Flash

RoHS Status :

ROHS3 Compliant

Mounting Type :

Surface Mount

Bit Size :

32

Core Size :

16-Bit

HTS Code :

8542.31.00.01

Terminal Pitch :

0.65mm

Time@Peak Reflow Temperature-Max (s) :

40

DMA Channels :

No

Number of I/O :

91

Width :

20mm

Supply Voltage-Max (Vsup) :

1.98V

Base Part Number :

MC9S12XEG128

Terminal Finish :

Matte Tin (Sn)

Terminal Form :

Gull wing

EEPROM Size :

2K x 8

ROM (words) :

131072

Packaging :

Tray

Program Memory Size :

128KB 128K x 8

Data Converter :

A/D 16x12b

DAC Channels :

No

Terminal Position :

QUAD

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Published :

2002

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Power Supplies :

3.3/5V

Series :

HCS12X

RAM Size :

12K x 8

Speed :

50MHz

Peak Reflow Temperature (Cel) :

260

Supply Voltage :

1.8V

JESD-609 Code :

e3

CPU Family :

CPU12

Additional Feature :

IT ALSO REQUIRES 5 V I/O SUPPLY

Supply Voltage-Min (Vsup) :

1.72V

Has ADC :

yes

PWM Channels :

yes

Factory Lead Time :

12 Weeks

Peripherals :

LVD, POR, PWM, WDT

Oscillator Type :

External

Height Seated (Max) :

1.6mm

Length :

20mm

Voltage - Supply (Vcc/Vdd) :

1.72V~5.5V

Operating Temperature :

-40°C~125°C TA

Package / Case :

112-LQFP

Clock Frequency :

40MHz

JESD-30 Code :

S-PQFP-G112

Surface Mount :

yes

Number of Terminations :

112

Qualification Status :

Not Qualified