MC9S12E256MPVE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Series :

HCS12

Supply Voltage-Min (Vsup) :

2.35V

Address Bus Width :

16

RoHS Status :

ROHS3 Compliant

Base Part Number :

MC9S12E256

Published :

1996

Speed :

25MHz

Packaging :

Tray

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~125°C TA

Factory Lead Time :

10 Weeks

Connectivity :

EBI/EMI, I2C, SCI, SPI

Height Seated (Max) :

1.6mm

ROM (words) :

262144

HTS Code :

8542.31.00.01

Has ADC :

yes

PWM Channels :

yes

Terminal Position :

QUAD

Data Converter :

A/D 16x10b; D/A 2x8b

Core Size :

16-Bit

Oscillator Type :

Internal

Width :

20mm

Power Supplies :

2.53.3/5V

External Data Bus Width :

16

Supply Voltage-Max (Vsup) :

2.75V

Supply Voltage :

2.5V

Peripherals :

POR, PWM, WDT

JESD-30 Code :

S-PQFP-G112

RAM Size :

16K x 8

Bit Size :

16

DMA Channels :

No

Surface Mount :

yes

Terminal Form :

Gull wing

Qualification Status :

Not Qualified

JESD-609 Code :

e3

Program Memory Type :

Flash

ECCN Code :

EAR99

Additional Feature :

ALSO REQUIRES 3.3V OR 5V SUPPLY

Number of Terminations :

112

Clock Frequency :

16MHz

Length :

20mm

Supply Current-Max :

65mA

Terminal Finish :

Tin (Sn)

CPU Family :

CPU12

Package / Case :

112-LQFP

Number of I/O :

91

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Terminal Pitch :

0.65mm

Time@Peak Reflow Temperature-Max (s) :

40

DAC Channels :

yes

Voltage - Supply (Vcc/Vdd) :

2.35V~2.75V

Program Memory Size :

256KB 256K x 8