MC9S12DT256MFUE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Number of Terminations :

80

Published :

2006

Terminal Finish :

Matte Tin (Sn)

Terminal Position :

QUAD

ROM (words) :

262144

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Program Memory Size :

256KB 256K x 8

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage :

2.5V

HTS Code :

8542.31.00.01

Height Seated (Max) :

2.45mm

Series :

HCS12

External Data Bus Width :

16

JESD-609 Code :

e3

Power Supplies :

2.55V

Supply Current-Max :

65mA

Number of I/O :

59

Core Size :

16-Bit

Program Memory Type :

Flash

Additional Feature :

ALSO REQUIRES 5V SUPPLY

DMA Channels :

No

Clock Frequency :

16MHz

Length :

14mm

Operating Temperature :

-40°C~125°C TA

Peripherals :

PWM, WDT

Terminal Form :

Gull wing

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Oscillator Type :

Internal

Speed :

25MHz

RoHS Status :

ROHS3 Compliant

CPU Family :

CPU12

Supply Voltage-Min (Vsup) :

2.35V

Factory Lead Time :

10 Weeks

Base Part Number :

MC9S12DT256

Qualification Status :

Not Qualified

Package / Case :

80-QFP

Peak Reflow Temperature (Cel) :

260

RAM Size :

12K x 8

Terminal Pitch :

0.65mm

Voltage - Supply (Vcc/Vdd) :

2.35V~5.25V

EEPROM Size :

4K x 8

Surface Mount :

yes

ECCN Code :

3A991.A.2

Packaging :

Tray

PWM Channels :

yes

Data Converter :

A/D 8x10b

Address Bus Width :

16

Width :

14mm

Has ADC :

yes

DAC Channels :

No

JESD-30 Code :

S-PQFP-G80

Bit Size :

16

Supply Voltage-Max (Vsup) :

2.75V