MC9S12DG256CPVE

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Mfr.Part #
MC9S12DG256CPVE
Manufacturer
NXP Semiconductors
Package / Case
112-LQFP
Datasheet
Download
Description
IC MCU 16BIT 256KB FLASH 112LQFP
Stock
619
In Stock :
619

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
External Data Bus Width :
16
Factory Lead Time :
10 Weeks
Terminal Position :
QUAD
Height Seated (Max) :
1.6mm
DAC Channels :
No
RAM Size :
12K x 8
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Supply Voltage-Max (Vsup) :
2.75V
Power Supplies :
2.55V
Terminal Pitch :
0.65mm
Published :
2005
Width :
20mm
DMA Channels :
No
Clock Frequency :
16MHz
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
Qualification Status :
Not Qualified
Voltage - Supply (Vcc/Vdd) :
2.35V~5.25V
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Additional Feature :
ALSO REQUIRES 5V SUPPLY
CPU Family :
CPU12
Terminal Finish :
Matte Tin (Sn)
Supply Current-Max :
65mA
Program Memory Size :
256KB 256K x 8
Package / Case :
112-LQFP
Series :
HCS12
Core Size :
16-Bit
Peripherals :
PWM, WDT
JESD-30 Code :
S-PQFP-G112
JESD-609 Code :
e3
Address Bus Width :
19
PWM Channels :
yes
HTS Code :
8542.31.00.01
Data Converter :
A/D 16x10b
Bit Size :
16
ROM (words) :
262144
Surface Mount :
yes
Speed :
25MHz
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
260
Length :
20mm
Number of Terminations :
112
Number of I/O :
91
Operating Temperature :
-40°C~85°C TA
Has ADC :
yes
Oscillator Type :
Internal
Supply Voltage-Min (Vsup) :
2.35V
Terminal Form :
Gull wing
Base Part Number :
MC9S12DG256
Program Memory Type :
Flash
Supply Voltage :
2.5V
EEPROM Size :
4K x 8
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Datasheets
MC9S12DG256CPVE
Introducing Microcontrollers NXP Semiconductors MC9S12DG256CPVE from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:112-LQFP, Number of Terminations:112, Operating Temperature:-40°C~85°C TA, Base Part Number:MC9S12DG256, MC9S12DG256CPVE pinout, MC9S12DG256CPVE datasheet PDF, MC9S12DG256CPVE amp .Beyond Microcontrollers NXP Semiconductors MC9S12DG256CPVE ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC9S12DG256CPVE


Microcontrollers NXP Semiconductors MC9S12DG256CPVE Overview

The Microcontrollers NXP Semiconductors MC9S12DG256CPVE is a robust 16-bit microcontroller designed to cater to the demanding requirements of embedded systems. Equipped with 256KB of flash memory, this microcontroller offers substantial space for application code, which is essential for complex operations in automotive and industrial applications. Its integration in a 112-LQFP package not only ensures compactness but also enhances the reliability with improved heat dissipation and lower lead inductance, making it ideal for high-performance, space-constrained environments. The Microcontrollers NXP Semiconductors MC9S12DG256CPVE supports a broad range of peripherals and offers flexibility in power management, making it an excellent choice for developers looking to push the boundaries of embedded system capabilities.

MC9S12DG256CPVE Features

This MCU features a comprehensive set of capabilities designed for versatility and efficiency. Key features include:

  • 16-bit HCS12 core for efficient processing and control.
  • 256KB of on-chip flash memory enabling extensive applications and updates.
  • Advanced Interrupt handling capabilities for real-time responsiveness.
  • Multiple communication interfaces such as CAN, SPI, and I2C for excellent connectivity options.
  • Low power consumption modes to ensure sustainability in energy-sensitive applications.
  • Digital and analog peripherals integrated for varied use cases.

MC9S12DG256CPVE Applications

  • Automotive Control Systems: Utilized in engine management and body control, enhancing vehicle performance and safety.
  • Industrial Automation: Drives complex machinery with precise control over manufacturing processes.
  • Medical Devices: Reliable for applications in medical monitoring equipment, ensuring accurate data handling and patient safety.
  • Consumer Electronics: Embedded in home automation systems and smart appliances, facilitating sophisticated user interfaces and connectivity.
  • Telecommunications: Key component in communication infrastructure, enabling robust network management and operations.
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