MC9S12DG256CPVE

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Mfr.Part #
MC9S12DG256CPVE
Manufacturer
NXP Semiconductors
Package / Case
112-LQFP
Datasheet
Download
Description
IC MCU 16BIT 256KB FLASH 112LQFP
Stock
619
In Stock :
619

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Height Seated (Max) :
1.6mm
Has ADC :
yes
Width :
20mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
40
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Core Size :
16-Bit
JESD-609 Code :
e3
Package / Case :
112-LQFP
Base Part Number :
MC9S12DG256
Operating Temperature :
-40°C~85°C TA
Supply Voltage :
2.5V
Supply Voltage-Min (Vsup) :
2.35V
ROM (words) :
262144
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PQFP-G112
Address Bus Width :
19
External Data Bus Width :
16
DMA Channels :
No
PWM Channels :
yes
Terminal Pitch :
0.65mm
Qualification Status :
Not Qualified
Program Memory Size :
256KB 256K x 8
Power Supplies :
2.55V
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Bit Size :
16
Data Converter :
A/D 16x10b
Program Memory Type :
Flash
Published :
2005
HTS Code :
8542.31.00.01
DAC Channels :
No
RAM Size :
12K x 8
Factory Lead Time :
10 Weeks
Clock Frequency :
16MHz
Peripherals :
PWM, WDT
Number of I/O :
91
Number of Terminations :
112
Additional Feature :
ALSO REQUIRES 5V SUPPLY
Terminal Form :
Gull wing
Length :
20mm
Terminal Position :
QUAD
Supply Current-Max :
65mA
EEPROM Size :
4K x 8
Speed :
25MHz
Oscillator Type :
Internal
Series :
HCS12
Peak Reflow Temperature (Cel) :
260
Supply Voltage-Max (Vsup) :
2.75V
CPU Family :
CPU12
Terminal Finish :
Matte Tin (Sn)
Voltage - Supply (Vcc/Vdd) :
2.35V~5.25V
Surface Mount :
yes
Mounting Type :
Surface Mount
Introducing Microcontrollers NXP Semiconductors MC9S12DG256CPVE from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:112-LQFP, Base Part Number:MC9S12DG256, Operating Temperature:-40°C~85°C TA, Number of Terminations:112, Mounting Type:Surface Mount, MC9S12DG256CPVE pinout, MC9S12DG256CPVE datasheet PDF, MC9S12DG256CPVE amp .Beyond Microcontrollers NXP Semiconductors MC9S12DG256CPVE ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC9S12DG256CPVE


Microcontrollers NXP Semiconductors MC9S12DG256CPVE Overview

The Microcontrollers NXP Semiconductors MC9S12DG256CPVE is a robust 16-bit microcontroller designed to cater to the demanding requirements of embedded systems. Equipped with 256KB of flash memory, this microcontroller offers substantial space for application code, which is essential for complex operations in automotive and industrial applications. Its integration in a 112-LQFP package not only ensures compactness but also enhances the reliability with improved heat dissipation and lower lead inductance, making it ideal for high-performance, space-constrained environments. The Microcontrollers NXP Semiconductors MC9S12DG256CPVE supports a broad range of peripherals and offers flexibility in power management, making it an excellent choice for developers looking to push the boundaries of embedded system capabilities.

MC9S12DG256CPVE Features

This MCU features a comprehensive set of capabilities designed for versatility and efficiency. Key features include:

  • 16-bit HCS12 core for efficient processing and control.
  • 256KB of on-chip flash memory enabling extensive applications and updates.
  • Advanced Interrupt handling capabilities for real-time responsiveness.
  • Multiple communication interfaces such as CAN, SPI, and I2C for excellent connectivity options.
  • Low power consumption modes to ensure sustainability in energy-sensitive applications.
  • Digital and analog peripherals integrated for varied use cases.

MC9S12DG256CPVE Applications

  • Automotive Control Systems: Utilized in engine management and body control, enhancing vehicle performance and safety.
  • Industrial Automation: Drives complex machinery with precise control over manufacturing processes.
  • Medical Devices: Reliable for applications in medical monitoring equipment, ensuring accurate data handling and patient safety.
  • Consumer Electronics: Embedded in home automation systems and smart appliances, facilitating sophisticated user interfaces and connectivity.
  • Telecommunications: Key component in communication infrastructure, enabling robust network management and operations.
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