MC9S12C32MPBE25

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Supply Voltage :

2.5V

Program Memory Size :

32KB 32K x 8

Base Part Number :

MC9S12C32

Operating Temperature :

-40°C~125°C TA

Terminal Form :

Gull wing

Core Size :

16-Bit

Program Memory Type :

Flash

Surface Mount :

yes

RAM Size :

2K x 8

DMA Channels :

No

Factory Lead Time :

10 Weeks

Clock Frequency :

50MHz

Mounting Type :

Surface Mount

Height Seated (Max) :

1.7mm

Series :

HCS12

Number of I/O :

35

External Data Bus Width :

16

Speed :

25MHz

Terminal Finish :

MATTE TIN

Width :

10mm

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Supply Voltage-Max (Vsup) :

2.75V

Peripherals :

POR, PWM, WDT

Data Converter :

A/D 8x10b

Voltage - Supply (Vcc/Vdd) :

2.35V~5.5V

ECCN Code :

EAR99

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

40

Published :

2005

Terminal Pitch :

0.65mm

Packaging :

Tray

DAC Channels :

No

JESD-30 Code :

S-PQFP-G52

Oscillator Type :

Internal

Address Bus Width :

16

Package / Case :

52-LQFP

Terminal Position :

QUAD

PWM Channels :

yes

Number of Terminations :

52

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

10mm

Bit Size :

16

Has ADC :

yes

JESD-609 Code :

e3

HTS Code :

8542.31.00.01

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER