MC9S08DZ60AMLH

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Finish :

Matte Tin (Sn)

Peak Reflow Temperature (Cel) :

260

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Number of Terminations :

64

Factory Lead Time :

10 Weeks

Length :

10mm

RAM Size :

4K x 8

Supply Voltage :

3V

DMA Channels :

No

Data Converter :

A/D 24x12b

Peripherals :

LVD, POR, PWM, WDT

Oscillator Type :

External

Operating Temperature :

-40°C~125°C TA

Terminal Position :

QUAD

HTS Code :

8542.31.00.01

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Bit Size :

8

Time@Peak Reflow Temperature-Max (s) :

40

Published :

2006

Width :

10mm

Program Memory Size :

60KB 60K x 8

ECCN Code :

3A991.A.2

Supply Voltage-Min (Vsup) :

2.7V

Supply Voltage-Max (Vsup) :

5.5V

Program Memory Type :

Flash

Packaging :

Tray

PWM Channels :

yes

Package / Case :

64-LQFP

Surface Mount :

yes

Series :

S08

EEPROM Size :

2K x 8

Base Part Number :

MC9S08DZ60

Number of I/O :

53

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

DAC Channels :

No

JESD-30 Code :

S-PQFP-G64

JESD-609 Code :

e3

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RoHS Status :

ROHS3 Compliant

Core Size :

8-Bit

Terminal Form :

Gull wing

Mounting Type :

Surface Mount

Speed :

40MHz

Terminal Pitch :

0.5mm

Height Seated (Max) :

1.6mm

Has ADC :

yes

Clock Frequency :

16MHz