MC56F8365VFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Supply Voltage-Max (Vsup) :

2.75V

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Data Converter :

A/D 16x12b

ECCN Code :

3A991.A.2

ROM (words) :

524288

Boundary Scan :

yes

Terminal Form :

Gull wing

Peripherals :

POR, PWM, Temp Sensor, WDT

JESD-30 Code :

R-PQFP-G128

Supply Voltage-Min (Vsup) :

2.25V

HTS Code :

8542.31.00.01

Mounting Type :

Surface Mount

Factory Lead Time :

10 Weeks

JESD-609 Code :

e3

Program Memory Type :

Flash

Published :

1998

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Series :

56F8xxx

Supply Voltage :

2.5V

Number of Terminations :

128

Clock Frequency :

120MHz

Base Part Number :

MC56F8365

Qualification Status :

Not Qualified

Low Power Mode :

yes

Height Seated (Max) :

1.6mm

RoHS Status :

ROHS3 Compliant

Operating Temperature :

-40°C~105°C TA

Address Bus Width :

11

Terminal Finish :

Matte Tin (Sn)

Core Size :

16-Bit

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Surface Mount :

yes

Package / Case :

128-LQFP

Terminal Pitch :

0.5mm

Oscillator Type :

External

Bit Size :

16

RAM Size :

18K x 16

Program Memory Size :

512KB 256K x 16

Core Processor :

56800E

Internal Bus Architecture :

Multiple

Number of I/O :

49

External Data Bus Width :

4

Format :

FIXED POINT

Speed :

60MHz

Length :

20mm

Barrel Shifter :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Position :

QUAD

Power Supplies :

2.53.3V

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

Width :

14mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray