MC56F8365VFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

Internal Bus Architecture :

Multiple

Peak Reflow Temperature (Cel) :

260

Low Power Mode :

yes

Terminal Form :

Gull wing

Height Seated (Max) :

1.6mm

Format :

FIXED POINT

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Terminal Pitch :

0.5mm

ECCN Code :

3A991.A.2

Series :

56F8xxx

Number of Terminations :

128

JESD-30 Code :

R-PQFP-G128

Program Memory Size :

512KB 256K x 16

Supply Voltage-Min (Vsup) :

2.25V

Operating Temperature :

-40°C~105°C TA

Clock Frequency :

120MHz

Data Converter :

A/D 16x12b

Packaging :

Tray

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Terminal Position :

QUAD

RAM Size :

18K x 16

Oscillator Type :

External

ROM (words) :

524288

Boundary Scan :

yes

Surface Mount :

yes

Address Bus Width :

11

Mounting Type :

Surface Mount

Supply Voltage :

2.5V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of I/O :

49

Speed :

60MHz

External Data Bus Width :

4

Core Processor :

56800E

Width :

14mm

RoHS Status :

ROHS3 Compliant

Package / Case :

128-LQFP

Base Part Number :

MC56F8365

Program Memory Type :

Flash

HTS Code :

8542.31.00.01

Length :

20mm

Bit Size :

16

Supply Voltage-Max (Vsup) :

2.75V

JESD-609 Code :

e3

Terminal Finish :

Matte Tin (Sn)

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Core Size :

16-Bit

Barrel Shifter :

yes

Peripherals :

POR, PWM, Temp Sensor, WDT

Published :

1998

Power Supplies :

2.53.3V

Factory Lead Time :

10 Weeks

Time@Peak Reflow Temperature-Max (s) :

40

Qualification Status :

Not Qualified