MC56F8365MFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Factory Lead Time :

10 Weeks

Terminal Position :

QUAD

Surface Mount :

yes

Qualification Status :

Not Qualified

Mounting Type :

Surface Mount

Width :

14mm

Number of I/O :

49

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

ROM (words) :

524288

RAM Size :

18K x 16

Operating Temperature :

-40°C~125°C TA

Number of Terminations :

128

Terminal Form :

Gull wing

Data Converter :

A/D 16x12b

JESD-30 Code :

R-PQFP-G128

External Data Bus Width :

4

Core Processor :

56800E

Barrel Shifter :

yes

Terminal Finish :

Matte Tin (Sn)

Supply Voltage-Max (Vsup) :

2.75V

Terminal Pitch :

0.5mm

Low Power Mode :

yes

Format :

FIXED POINT

Length :

20mm

Peripherals :

POR, PWM, Temp Sensor, WDT

Supply Voltage-Min (Vsup) :

2.25V

Published :

1998

HTS Code :

8542.31.00.01

Address Bus Width :

11

Program Memory Size :

512KB 256K x 16

Oscillator Type :

External

Series :

56F8xxx

Speed :

60MHz

Time@Peak Reflow Temperature-Max (s) :

40

Height Seated (Max) :

1.6mm

Boundary Scan :

yes

Peak Reflow Temperature (Cel) :

260

Power Supplies :

2.53.3V

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Bit Size :

16

Program Memory Type :

Flash

Supply Voltage :

2.5V

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Core Size :

16-Bit

Base Part Number :

MC56F8365

Package / Case :

128-LQFP

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

ECCN Code :

3A991.A.2

JESD-609 Code :

e3

Clock Frequency :

120MHz

Internal Bus Architecture :

Multiple