MC56F8157VPYE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage :

2.5V

RAM Size :

8K x 16

Bit Size :

16

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Peripherals :

POR, PWM, WDT

Core Size :

16-Bit

Factory Lead Time :

10 Weeks

Power Supplies :

2.53.3V

Boundary Scan :

yes

JESD-609 Code :

e3

Core Processor :

56800E

Supply Voltage-Max (Vsup) :

2.75V

Length :

24mm

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

ROM (words) :

262144

Mounting Type :

Surface Mount

External Data Bus Width :

16

Operating Temperature :

-40°C~105°C TA

Program Memory Size :

256KB 128K x 16

Qualification Status :

Not Qualified

Width :

24mm

Height Seated (Max) :

1.6mm

Number of Terminations :

160

Format :

FIXED POINT

RoHS Status :

ROHS3 Compliant

Address Bus Width :

24

Base Part Number :

MC56F8157

ECCN Code :

3A991.A.2

HTS Code :

8542.31.00.01

Program Memory Type :

Flash

Surface Mount :

yes

Oscillator Type :

External

Packaging :

Tray

Connectivity :

EBI/EMI, SCI, SPI

Number of I/O :

76

Speed :

40MHz

Data Converter :

A/D 16x12b

Terminal Finish :

Matte Tin (Sn)

Terminal Pitch :

0.5mm

Supply Voltage-Min (Vsup) :

2.25V

Published :

1998

Series :

56F8xxx

Terminal Position :

QUAD

Internal Bus Architecture :

Multiple

Barrel Shifter :

yes

Peak Reflow Temperature (Cel) :

260

Package / Case :

160-LQFP

Terminal Form :

Gull wing

JESD-30 Code :

S-PQFP-G160

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

Low Power Mode :

yes

Clock Frequency :

120MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)