MB9AF116MAPMC-G-JNE2

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Mfr.Part #
MB9AF116MAPMC-G-JNE2
Manufacturer
Infineon Technologies
Package / Case
80-LQFP
Datasheet
Download
Description
IC MCU 32BIT 512KB FLASH 80LQFP
Stock
17,249
In Stock :
17,249

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Manufacturer :
Infineon Technologies
Product Category :
Microcontrollers
RAM Size :
32K x 8
HTS Code :
8542.31.00.01
Data Bus Width :
32b
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Memory Size :
512kB
Interface :
EBI/EMI, I2C, LIN, SPI, UART, USART
Number of Timers/Counters :
11
Frequency :
40MHz
Connectivity :
EBI/EMI, I2C, SIO, UART/USART
Core Processor :
ARM® Cortex®-M3
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Program Memory Type :
Flash
Core Architecture :
ARM
Peripherals :
DMA, LVD, POR, PWM, WDT
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Number of I/O :
66
Oscillator Type :
Internal
Package / Case :
80-LQFP
Operating Temperature :
-40°C~105°C TA
Data Converter :
A/D 12x12b
RoHS Status :
ROHS3 Compliant
Watchdog Timer :
yes
Program Memory Size :
512KB 512K x 8
Series :
FM3 MB9A110A
Factory Lead Time :
17 Weeks
Core Size :
32-Bit
JESD-609 Code :
e3
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Published :
2010
Terminal Finish :
Tin (Sn)
Introducing Microcontrollers Infineon Technologies MB9AF116MAPMC-G-JNE2 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:80-LQFP, Operating Temperature:-40°C~105°C TA, MB9AF116MAPMC-G-JNE2 pinout, MB9AF116MAPMC-G-JNE2 datasheet PDF, MB9AF116MAPMC-G-JNE2 amp .Beyond Microcontrollers Infineon Technologies MB9AF116MAPMC-G-JNE2 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies MB9AF116MAPMC-G-JNE2


Microcontrollers Infineon Technologies MB9AF116MAPMC-G-JNE2 Overview

The MB9AF116MAPMC-G-JNE2, manufactured by Infineon Technologies, is a high-performance microcontroller unit (MCU) designed to cater to advanced embedded systems. This 32-bit MCU is built on Infineon's robust processing architecture, providing a seamless blend of power efficiency and processing capability. With a substantial 512KB of flash memory, this product is ideal for applications requiring substantial code storage or complex software routines. The incorporation of the 80LQFP package ensures a compact footprint while allowing for efficient system integration. Leveraging the capability of the Microcontrollers Infineon Technologies MB9AF116MAPMC-G-JNE2, designers can achieve an optimized balance between performance and power consumption, making it a preferred choice for sophisticated electronic designs.

MB9AF116MAPMC-G-JNE2 Features

This MCU offers a comprehensive feature set that enhances its applicability in a variety of demanding applications. Key features include:

  • 32-bit CPU core for efficient data handling and processing speed.
  • 512KB of flash memory, providing ample space for application code and data storage.
  • Low power consumption modes to extend battery life in portable applications.
  • 80-pin LQFP package that supports a compact design without compromising on connectivity and performance.
  • Advanced peripherals including timers, ADCs, and communication interfaces such as SPI, I2C, and UART.

MB9AF116MAPMC-G-JNE2 Applications

  • Automotive Control Systems: Utilized in engine management and infotainment systems where robust performance and reliability are essential.
  • Industrial Automation: Serves as the core for controllers and monitoring systems that require precise real-time operation and connectivity.
  • Smart Home Devices: Empowers a range of consumer electronics, from smart thermostats to security systems, enabling intelligent device communication and enhanced user experience.
  • Healthcare Equipment: Integral to devices like portable monitors and diagnostic systems where accuracy and dependability are paramount.
  • Internet of Things (IoT) Gadgets: Provides the processing power needed for connectivity and data management in IoT devices, fostering innovation in connected technology.
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