MAX6615AEE+T

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Mfr.Part #
MAX6615AEE+T
Manufacturer
Analog Devices, Inc.
Package / Case
16-SSOP (0.154, 3.90mm Width)
Datasheet
Download
Description
IC TEMP MONITOR DL-CH 16-QSOP
Stock
12
In Stock :
12

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Manufacturer :
Analog Devices, Inc.
Product Category :
Thermal Management
Package / Case :
16-SSOP (0.154, 3.90mm Width)
Body Breadth :
3.9 mm
Lead Free :
Lead Free
Output Alarm :
yes
RoHS Status :
ROHS3 Compliant
Sensors/Transducers Type :
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Number of Terminations :
16
Surface Mount :
yes
Terminal Finish :
Matte Tin (Sn)
Power Supplies :
3.3/5V
Body Length or Diameter :
8.65mm
Topology :
ADC, PWM Generator, Tach Counter
Termination Type :
Solder
Accuracy :
±4°C(Max)
Base Part Number :
MAX6615
Published :
2008
Body Height :
1.64mm
Pbfree Code :
yes
Output Interface Type :
2-WIRE INTERFACE
Factory Lead Time :
6 Weeks
Sensor Type :
Internal and External
HTS Code :
8542.31.00.01
Packaging :
Tape and Reel (TR)
Sensing Temperature :
-40°C~125°C
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Operating Temperature :
-40°C~125°C
Mounting Type :
Surface Mount
Output Type :
SMBus
Function :
Fan Control, Temp Monitor
JESD-609 Code :
e3
ECCN Code :
EAR99
Number of Bits :
8
Voltage - Supply :
3V~5.5V
Datasheets
MAX6615AEE+T
Introducing Thermal Management Analog Devices, Inc. MAX6615AEE+T from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:16-SSOP (0.154, 3.90mm Width), Number of Terminations:16, Base Part Number:MAX6615, Operating Temperature:-40°C~125°C, Mounting Type:Surface Mount, MAX6615AEE+T pinout, MAX6615AEE+T datasheet PDF, MAX6615AEE+T amp .Beyond Thermal Management Analog Devices, Inc. MAX6615AEE+T ,we also offer LTC2991IMS#PBF, DS1629S+, SE97BTP,547, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. MAX6615AEE+T


Thermal Management Analog Devices, Inc. MAX6615AEE+T Overview

The MAX6615AEE+T from Analog Devices, Inc. is a sophisticated dual-channel temperature monitor designed to ensure precise thermal management in complex electronic systems. Engineered with advanced sensing technology, this IC provides real-time temperature readings, facilitating optimal system performance and reliability. The small form factor of the 16-QSOP package makes it ideal for space-constrained applications, while offering robust functionality that supports both high accuracy and low power consumption. With its ability to monitor multiple devices, the MAX6615AEE+T serves as an essential component for managing system temperatures, thus protecting hardware investment and enhancing overall system stability.

MAX6615AEE+T Features

The MAX6615AEE+T includes a range of features designed for comprehensive temperature monitoring and system protection:

  • Dual-channel temperature sensing for simultaneous monitoring of multiple points.
  • High accuracy and low power consumption enhance system efficiency and reliability.
  • Configurable overtemperature alarm output, which enables proactive system protection.
  • Compact 16-QSOP package suitable for space-constrained applications.
  • Easy integration with a variety of microcontrollers for versatile use across different platforms.

MAX6615AEE+T Applications

  • Computing Systems: In PCs and servers, the MAX6615AEE+T monitors CPU and GPU temperatures to prevent overheating, ensuring efficient thermal regulation.
  • Telecommunications Equipment: Utilized in network routers and switches to monitor system temperature, safeguarding against thermal-induced failures that can disrupt communications.
  • Consumer Electronics: Applied in devices like gaming consoles and VR equipment to manage heat generation, thus enhancing user experience and device longevity.
  • Industrial Systems: Ensures optimal performance in industrial automation systems by monitoring temperature in real-time, preventing equipment malfunctions due to excessive heat.
  • Medical Devices: Used in medical diagnostic equipment to monitor critical component temperatures, ensuring accurate and reliable device operation under stringent conditions.
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