MAX3072EESA+
- Mfr.Part #
- MAX3072EESA+
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8SOIC
- Stock
- 8,593
- In Stock :
- 8,593
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- Drivers, Receivers, Transceivers
- Interface :
- RS-422, RS-485
- Base Part Number :
- MAX3072
- Number of Transceivers :
- 1
- Mount :
- Surface Mount
- ECCN Code :
- EAR99
- Simplex/Duplex :
- Half Duplex
- Receiver Number of Bits :
- 1
- Terminal Position :
- Dual
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Published :
- 2003
- Factory Lead Time :
- 6 Weeks
- Operating Supply Voltage :
- 3.3V
- Supply Voltage :
- 3.3V
- Pin Count :
- 8
- Duplex :
- Half
- Protocol :
- RS422, RS485
- Width :
- 4mm
- Differential Output :
- yes
- Number of Functions :
- 1
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Mounting Type :
- Surface Mount
- Receiver Hysteresis :
- 100mV
- Packaging :
- Tube
- JESD-609 Code :
- e3
- Lead Free :
- Lead Free
- Voltage - Supply :
- 3V~3.6V
- Pbfree Code :
- yes
- RoHS Status :
- ROHS3 Compliant
- Number of Terminations :
- 8
- Terminal Form :
- Gull wing
- Peak Reflow Temperature (Cel) :
- 260
- Receive Delay-Max :
- 200 ns
- Operating Supply Current :
- 1.5mA
- Contact Plating :
- Tin
- ESD Protection :
- yes
- Radiation Hardening :
- No
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Length :
- 5mm
- Type :
- Transceiver
- Manufacturer Package Identifier :
- S8+4
- Max Power Dissipation :
- 471mW
- Number of Pins :
- 8
- Driver Number of Bits :
- 1
- Weight :
- 506.605978mg
- Data Rate :
- 250kbps
- Height :
- 1.5mm
- Number of Drivers/Receivers :
- 1/1
- Operating Temperature :
- -40°C~85°C
- Input Characteristics :
- DIFFERENTIAL SCHMITT TRIGGER
- REACH SVHC :
- No SVHC
- Datasheets
- MAX3072EESA+

[Drivers, Receivers, Transceivers] Overview
The MAX3072EESA+ by Analog Devices, Inc. is a highly efficient integrated circuit transceiver designed to facilitate seamless communication in various electronic systems. With its compact form factor and advanced functionality, this transceiver is an ideal choice for demanding industrial applications.
Engineered with precision and reliability in mind, the MAX3072EESA+ excels in providing robust performance in half-duplex communication setups. Its innovative design enables efficient data transmission and reception, ensuring smooth operation even in challenging environments.
Whether you're integrating it into automotive systems, industrial automation, or telecommunications infrastructure, the MAX3072EESA+ delivers unparalleled performance, making it the preferred choice for professionals seeking top-tier transceiver solutions.
MAX3072EESA+ Features
- Half-duplex communication support
- Compact 8SOIC package for easy integration
- Highly efficient transceiver design
- Robust performance in demanding environments
- Wide range of operating voltages: 2.4V to 5.5V
- Low-power consumption for energy-efficient operation
- Enhanced ESD protection for increased reliability
- Industrial temperature range: -40°C to +85°C
MAX3072EESA+ Applications
- Industrial Automation: The MAX3072EESA+ facilitates seamless communication in industrial control systems, enabling real-time data exchange between sensors, actuators, and central controllers. Its robust design ensures reliable performance in harsh industrial environments, making it an essential component in factory automation and process control systems.
- Automotive Electronics: In automotive applications, the MAX3072EESA+ plays a crucial role in enabling communication between various electronic modules within the vehicle. From engine control units to body control modules, this transceiver ensures smooth and reliable data transmission, contributing to the overall efficiency and safety of modern automotive systems.
- Telecommunications Infrastructure: The MAX3072EESA+ is well-suited for telecommunications infrastructure, where it facilitates data transmission in networking equipment, base stations, and communication interfaces. Its compact form factor and high-performance capabilities make it an ideal choice for building robust and efficient communication networks that meet the demands of modern telecommunications systems.
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