M83513/13-C01NP

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Mfr.Part #
M83513/13-C01NP
Manufacturer
ITT Cannon
Package / Case
Datasheet
Download
Description
MICRO-D RECEPTACLE 21POS R/A PCB
Stock
82
In Stock :
82

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Manufacturer :
ITT Cannon
Product Category :
D-Sub Connector Assemblies
Product :
Connectors
Shell Material :
Aluminum
Mounting Type :
BOARD
Mating Information :
MULTIPLE MATING PARTS AVAILABLE
Pitch :
2.5400 mm
Shell Size :
C
Product Status :
Active
Number of Rows :
2
PCB Contact Pattern :
STAGGERED
Board Mounting Option :
HOLE.096
Body Orientation :
RIGHT ANGLE
Series :
M83513
Empty Shell :
No
Minimum Operating Temperature (°C) :
-55
Current Rating :
3 A
Number of Positions :
21 Position
Product Type :
D-Sub MIL Spec Connectors
Body/Shell Style :
Receptacle
Connector Type :
D MICROMINIATURE CONNECTOR
IEC Conformance :
No
Mixed Contacts :
No
Termination Style :
Through Hole
Number of Contacts :
21
Product Height (mm) :
7.87
Maximum Operating Temperature (°C) :
150
Option :
GENERAL PURPOSE
Shell Finish :
Nickel
Body Depth :
0.425 inch
Mounting Option 2 :
JACKPOST
Dielectric Withstanding Voltage :
600VAC V
Product Depth (mm) :
15.75
Termination Type :
Solder
Contact Plating :
Gold Over Nickel
Filter Feature :
No
Reliability :
MIL-C-83513
Insulation :
Not Insulated
Product Length (mm) :
27.56
Contact Arrangement :
S21P0
RoHS Status :
RoHS Compliant
Maximum Current Rating (A) :
3
Rated Current (Signal) :
3 A
Total Number of Contacts :
21
Mating Contact Row Spacing :
0.043 inch
Number of Ports :
1
RoHS :
Details
Base/Housing Material :
Aluminum
Product Length :
27.56 mm
Mounting Style :
Panel
Termination Method :
Solder
Qualification :
EREL
ECCN (US) :
EAR99
Insulation Resistance (MOhm) :
5000
Package :
Bulk
Durability :
500 Cycles
Reference Standard :
MIL
Product Category :
D-Sub MIL Spec Connectors
Terminal Pitch (mm) :
1.27
Terminal Pitch :
2.54 mm
DIN Conformance :
No
Shell Plating :
Electroless Nickel
Type :
Micro D-Subminiature
Contact Pattern :
STAGGERED
Maximum Contact Resistance (mOhm) :
8
Mounting Option 1 :
#2-56
Gender :
RCP
Reach Compliance Code :
Compliant
PCB Contact Row Spacing :
2.54 mm
Insertion Force-Max :
2.78 N
Plating Thickness :
50u inch
Contact Style :
RND PIN-SKT
Withdrawl Force-Min :
0.139 N
Manufacturer :
Glenair
Contact Resistance :
8 mΩ
Operating Temperature :
-55 to 150 °C
Mating Cycle (Cycles) :
500
MIL Conformance :
No
Less Contact :
No
Number of Terminals :
21
Mounting :
Through Hole
Brand :
Glenair
Number Of PCB Rows :
3
Body Breadth :
0.325 inch
Terminal Length :
0.109 inch
Additional Feature :
STANDARD: MIL-DTL-83513
Mating Contact Pitch :
0.05 inch
Mounting Angle :
RIGHT ANGLE
Tradename :
MIL-DTL-83513
Insulation Resistance :
5000000000 Ω
Subcategory :
MIL-Spec / MIL-Type
Contact Gender :
SKT
Contact Material :
Phosphor Bronze
Datasheets
M83513/13-C01NP
Introducing D-Sub Connector Assemblies ITT Cannon M83513/13-C01NP from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:BOARD, Type:Micro D-Subminiature, Operating Temperature:-55 to 150 °C, M83513/13-C01NP pinout, M83513/13-C01NP datasheet PDF, M83513/13-C01NP amp .Beyond D-Sub Connector Assemblies ITT Cannon M83513/13-C01NP ,we also offer ICD15S13E4GX00LF, L77SDEH09SOL2RM5, A-DF 25 A/KG-T2S, Our vast inventory has you covered. Contact us now for immediate solutions.

ITT Cannon M83513/13-C01NP


M83513 Series D MICROMINIATURE CONNECTOR 21 Position-Position RCP BOARD Phosphor Bronze

M83513/13-C01NP Overview


Packaging for this item is D MICROMINIATURE CONNECTOR.BOARD is the type of mounting for the device.The product is a member of the M83513 Series.Among other features are STANDARD: MIL-DTL-83513, to name only a few.The device has 1 ports for managing a variety of tasks.It operates at an operating temperature of -55 to 150 °C.

M83513/13-C01NP Features


M83513 series


M83513/13-C01NP Applications


There are a lot of Glenair
M83513/13-C01NP D-Sub Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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