M2S060T-FG676

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Pitch :

1mm

Peripherals :

DDR, PCIe, SERDES

Supply Voltage-Max (Vsup) :

1.26V

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Number of Terminations :

676

Width :

27mm

Published :

2015

Length :

27mm

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Number of Outputs :

387

RAM Size :

64KB

RoHS Status :

Non-RoHS Compliant

Number of I/O :

387

Flash Size :

256KB

Power Supplies :

1.2V

Reach Compliance Code :

not_compliant

Series :

SmartFusion®2

JESD-30 Code :

S-PBGA-B676

Number of Logic Cells :

56520

Architecture :

MCU, FPGA

Surface Mount :

yes

Operating Temperature :

0°C~85°C TJ

Packaging :

Tray

Terminal Form :

Ball

Height Seated (Max) :

2.44mm

Speed :

166MHz

Package / Case :

676-BGA

Supply Voltage :

1.2V

Core Processor :

ARM® Cortex®-M3

Qualification Status :

Not Qualified

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Supply Voltage-Min (Vsup) :

1.14V

HTS Code :

8542.39.00.01

Factory Lead Time :

10 Weeks

Terminal Finish :

Tin/Lead (Sn/Pb)

Number of Inputs :

387

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Terminal Position :

BOTTOM

Primary Attributes :

FPGA - 60K Logic Modules

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

JESD-609 Code :

e0