M2S060-1FGG676
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- Mfr.Part #
- M2S060-1FGG676
- Manufacturer
- Microchip Technology
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 676FBGA
- Stock
- 47,990
- In Stock ：
- 47,990
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Terminations :
- 676
- Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Length :
- 27mm
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Supply Voltage-Max (Vsup) :
- 1.26V
- Number of Outputs :
- 387
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Pitch :
- 1mm
- Number of Inputs :
- 387
- Speed :
- 166MHz
- Terminal Finish :
- MATTE TIN
- Architecture :
- MCU, FPGA
- Qualification Status :
- Not Qualified
- Core Processor :
- ARM® Cortex®-M3
- Packaging :
- Tray
- Supply Voltage-Min (Vsup) :
- 1.14V
- Published :
- 2015
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Height Seated (Max) :
- 2.44mm
- Package / Case :
- 676-BGA
- Surface Mount :
- yes
- Width :
- 27mm
- Number of Logic Cells :
- 56520
- Number of I/O :
- 387
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- SmartFusion®2
- Peripherals :
- DDR, PCIe, SERDES
- RoHS Status :
- RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- JESD-609 Code :
- e3
- Flash Size :
- 256KB
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Primary Attributes :
- FPGA - 60K Logic Modules
- RAM Size :
- 64KB
- Power Supplies :
- 1.2V
- JESD-30 Code :
- S-PBGA-B676
- Datasheets
- M2S060-1FGG676
676 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 387 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 676-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 387 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 676 terminations, which is great for system on a chip.There are 387 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 387 inputs available for use.Logic system on chips consist of 56520 logic cells.There is a flash of 256KB on it.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-1FGG676 System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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