M2S060-1FCSG325

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

Number of Terminations :

325

Number of I/O :

200

Factory Lead Time :

10 Weeks

Peripherals :

DDR, PCIe, SERDES

Terminal Position :

BOTTOM

Series :

SmartFusion®2

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Pitch :

0.5mm

Surface Mount :

yes

Primary Attributes :

FPGA - 60K Logic Modules

Terminal Form :

Ball

Packaging :

Tray

Supply Voltage-Min (Vsup) :

1.14V

RAM Size :

64KB

Length :

11mm

Supply Voltage-Max (Vsup) :

1.26V

Operating Temperature :

-40°C~100°C TJ

HTS Code :

8542.39.00.01

JESD-30 Code :

S-PBGA-B325

Lifecycle Status :

IN PRODUCTION (Last Updated: 2 weeks ago)

Package / Case :

325-TFBGA, CSPBGA

Qualification Status :

Not Qualified

Height Seated (Max) :

1.01mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Logic Cells :

56520

Power Supplies :

1.2V

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Published :

2015

RoHS Status :

RoHS Compliant

Terminal Finish :

MATTE TIN

Core Processor :

ARM® Cortex®-M3

Architecture :

MCU, FPGA

Additional Feature :

LG-MIN, WD-MIN

Speed :

166MHz

JESD-609 Code :

e3

Width :

11mm

Number of Inputs :

200

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Supply Voltage :

1.2V

Flash Size :

256KB

Number of Outputs :

200

Peak Reflow Temperature (Cel) :

NOT SPECIFIED