M2S050T-1FCS325I
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- Mfr.Part #
- M2S050T-1FCS325I
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 28,645
- In Stock ：
- 28,645
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Terminal Form :
- Ball
- Operating Temperature :
- -40°C~100°C TJ
- Packaging :
- Tray
- Number of I/O :
- 200
- Package / Case :
- 325-TFBGA, CSPBGA
- Published :
- 2015
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 11mm
- Additional Feature :
- LG-MIN, WD-MIN
- Peripherals :
- DDR, PCIe, SERDES
- Supply Voltage :
- 1.2V
- Number of Inputs :
- 200
- RAM Size :
- 64KB
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Surface Mount :
- yes
- Number of Logic Cells :
- 56340
- Length :
- 11mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Speed :
- 166MHz
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B325
- Number of Terminations :
- 325
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Outputs :
- 200
- Flash Size :
- 256KB
- Series :
- SmartFusion®2
- Primary Attributes :
- FPGA - 50K Logic Modules
- Power Supplies :
- 1.2V
- Reach Compliance Code :
- not_compliant
- Architecture :
- MCU, FPGA
- Supply Voltage-Max (Vsup) :
- 1.26V
- Terminal Pitch :
- 0.5mm
- HTS Code :
- 8542.39.00.01
- Qualification Status :
- Not Qualified
- Height Seated (Max) :
- 1.01mm
- Supply Voltage-Min (Vsup) :
- 1.14V
- Core Processor :
- ARM® Cortex®-M3
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Datasheets
- M2S050T-1FCS325I
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 50K Logic Modules.Housed in the state-of-art Tray package.200 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 325 terminations in total and that really benefits system on a chip.You can have 200 user outputs for this SoC chip.System on chip requires 1.2V power supplies.200 inputs are available on the SoC chip.Logic system on chips features 56340 logic cells.It has a 256KB flash.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050T-1FCS325I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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