M2S050-1FCS325I
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- Mfr.Part #
- M2S050-1FCS325I
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 1,101
- In Stock ：
- 1,101
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Series :
- SmartFusion®2
- Terminal Pitch :
- 0.5mm
- Width :
- 11mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-609 Code :
- e0
- Primary Attributes :
- FPGA - 50K Logic Modules
- RAM Size :
- 64KB
- Operating Temperature :
- -40°C~100°C TJ
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Number of Outputs :
- 200
- HTS Code :
- 8542.39.00.01
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Architecture :
- MCU, FPGA
- Reach Compliance Code :
- not_compliant
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 325-TFBGA, CSPBGA
- JESD-30 Code :
- S-PBGA-B325
- Supply Voltage-Max (Vsup) :
- 1.26V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Logic Cells :
- 56340
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- Additional Feature :
- LG-MIN, WD-MIN
- Power Supplies :
- 1.2V
- Supply Voltage-Min (Vsup) :
- 1.14V
- Peripherals :
- DDR, PCIe, SERDES
- Number of Terminations :
- 325
- Length :
- 11mm
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 1.01mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Speed :
- 166MHz
- Number of I/O :
- 200
- Flash Size :
- 256KB
- Number of Inputs :
- 200
- Core Processor :
- ARM® Cortex®-M3
- Datasheets
- M2S050-1FCS325I
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 200 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 325 terminations.A SoC chip like this can have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 200 inputs that can be used.The logic SoC features 56340 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCS325I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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