M2S010TS-1FG484M
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- Mfr.Part #
- M2S010TS-1FG484M
- Manufacturer
- Microchip Technology
- Package / Case
- 484-BGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 484FBGA
- Stock
- 32,732
- In Stock ：
- 32,732
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- JESD-609 Code :
- e0
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Architecture :
- MCU, FPGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Surface Mount :
- yes
- Terminal Form :
- Ball
- Number of Outputs :
- 233
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Supply Voltage :
- 1.2V
- Operating Temperature :
- -55°C~125°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Width :
- 23mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Power Supplies :
- 1.2V
- Package / Case :
- 484-BGA
- Primary Attributes :
- FPGA - 10K Logic Modules
- JESD-30 Code :
- S-PBGA-B484
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peripherals :
- DDR, PCIe, SERDES
- Height Seated (Max) :
- 2.44mm
- Terminal Pitch :
- 1mm
- Supply Voltage-Max (Vsup) :
- 1.26V
- Packaging :
- Tray
- Number of I/O :
- 233
- Factory Lead Time :
- 10 Weeks
- ECCN Code :
- 3A001.A.2.C
- Length :
- 23mm
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of Logic Cells :
- 12084
- Speed :
- 166MHz
- Number of Inputs :
- 233
- Qualification Status :
- Not Qualified
- Series :
- SmartFusion®2
- Core Processor :
- ARM® Cortex®-M3
- HTS Code :
- 8542.39.00.01
- Flash Size :
- 256KB
- RAM Size :
- 64KB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Terminations :
- 484
- Datasheets
- M2S010TS-1FG484M
484 Terminations -55°C~125°C TJ System On Chip SmartFusion®2 Series 233 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -55°C~125°C TJ.This SoC security combines FPGA - 10K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.233 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 484 terminations, so system on a chip is really aided by this.There is the option to have 233 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 233.There are 12084 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1FG484M System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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