M2S010T-VF256
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- Mfr.Part #
- M2S010T-VF256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 18,566
- In Stock ：
- 18,566
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Terminations :
- 256
- Supply Voltage-Min (Vsup) :
- 1.14V
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- yes
- Width :
- 14mm
- Number of I/O :
- 138
- Supply Voltage-Max (Vsup) :
- 1.26V
- Speed :
- 166MHz
- Terminal Form :
- Ball
- Series :
- SmartFusion®2
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Voltage :
- 1.2V
- Number of Inputs :
- 138
- Length :
- 14mm
- Packaging :
- Tray
- Reach Compliance Code :
- not_compliant
- Operating Temperature :
- 0°C~85°C TJ
- Number of Outputs :
- 138
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Additional Feature :
- LG-MIN, WD-MIN
- Peripherals :
- DDR, PCIe, SERDES
- Flash Size :
- 256KB
- Height Seated (Max) :
- 1.56mm
- Number of Logic Cells :
- 12084
- Architecture :
- MCU, FPGA
- Factory Lead Time :
- 10 Weeks
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Core Processor :
- ARM® Cortex®-M3
- RAM Size :
- 64KB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Primary Attributes :
- FPGA - 10K Logic Modules
- JESD-30 Code :
- S-PBGA-B256
- Power Supplies :
- 1.2V
- Published :
- 2015
- Package / Case :
- 256-LFBGA
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 0.8mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Datasheets
- M2S010T-VF256
256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 256-LFBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 10K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.138 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 256 terminations, so system on a chip is really aided by this.There is the option to have 138 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 138.There are 12084 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010T-VF256 System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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