M2S010-VFG256
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- Mfr.Part #
- M2S010-VFG256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 9,316
- In Stock ：
- 9,316
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Terminations :
- 256
- Core Processor :
- ARM® Cortex®-M3
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Propagation Delay :
- 3.316 ns
- Max Supply Voltage :
- 3.45V
- Length :
- 14mm
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Memory Size :
- 256KB
- Terminal Form :
- Ball
- Package / Case :
- 256-LBGA
- Architecture :
- MCU, FPGA
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 1.2V
- Memory Type :
- Flash
- Supply Voltage :
- 1.2V
- Series :
- SmartFusion®2
- Factory Lead Time :
- 11 Weeks
- Min Supply Voltage :
- 1.14V
- Surface Mount :
- yes
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- JESD-609 Code :
- e3
- Max Junction Temperature (Tj) :
- 85°C
- Flash Size :
- 256KB
- Operating Temperature :
- 0°C~85°C TJ
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 days ago)
- Terminal Pitch :
- 0.8mm
- Number of I/O :
- 138
- Height :
- 1.56mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Frequency :
- 340MHz
- Number of Outputs :
- 138
- RAM Size :
- 64KB
- Published :
- 2015
- Number of Logic Elements/Cells :
- 12084
- Peripherals :
- DDR, PCIe, SERDES
- Lead Free :
- Lead Free
- Width :
- 14mm
- JESD-30 Code :
- S-PBGA-B256
- Terminal Position :
- BOTTOM
- RoHS Status :
- RoHS Compliant
- Number of Inputs :
- 138
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Finish :
- MATTE TIN
- Additional Feature :
- LG-MIN, WD-MIN
- Primary Attributes :
- FPGA - 10K Logic Modules
- Datasheets
- M2S010-VFG256
256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V Min 1.14V V Max 3.45V V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 10K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 138 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 138 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 138 inputs.This flash has a size of 256KB.During operation, the wireless SoC runs at a frequency of 340MHz.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.Voltages up to 3.45V are specified for this SoC security.Power is provided to it at least to the extent that 1.14V is required.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-VFG256 System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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