M29DW323DB70N6E

Manufacturer :

Micron Technology

Product Category :

Memory

Common Flash Interface :

yes

JESD-609 Code :

e3

Time@Peak Reflow Temperature-Max (s) :

30

Memory Format :

Flash

Width :

12mm

Alternate Memory Width :

8

Mounting Type :

Surface Mount

Data Polling :

yes

Sector Size :

8K64K

Boot Block :

BOTTOM

REACH SVHC :

No SVHC

Length :

18.4mm

Pbfree Code :

yes

Number of Pins :

48

Access Time (Max) :

70 ns

Surface Mount :

yes

Number of Terminations :

48

Memory Interface :

Parallel

Density :

32 Mb

Voltage :

2.7V

Power Supplies :

3/3.3V

Terminal Pitch :

0.5mm

Packaging :

Tray

Peak Reflow Temperature (Cel) :

260

RoHS Status :

ROHS3 Compliant

Memory Width :

16

Height Seated (Max) :

1.2mm

Voltage - Supply :

2.7V~3.6V

Pin Count :

48

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Command User Interface :

yes

Package / Case :

48-TFSOP (0.724, 18.40mm Width)

Memory Type :

Non-Volatile

Termination :

SMD/SMT

Standby Current-Max :

0.0001A

Ready/Busy :

yes

Organization :

2MX16

HTS Code :

8542.32.00.51

Number of Functions :

1

Write Cycle Time - Word, Page :

70ns

Nominal Supply Current :

10mA

Memory Size :

32Mb 4M x 8 2M x 16

Supply Voltage :

3V

ECCN Code :

3A991.B.1.A

Sync/Async :

ASYNCHRONOUS

Terminal Position :

Dual

Toggle Bit :

yes

Radiation Hardening :

No

Base Part Number :

M29DW323

Contact Plating :

Tin

Published :

2004

Additional Feature :

BOTTOM BOOT BLOCK

Operating Temperature :

-40°C~85°C TA

Number of Sectors/Size :

863