M1AFS1500-2FGG676I

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Mfr.Part #
M1AFS1500-2FGG676I
Manufacturer
Microchip Technology
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 252 I/O 676FBGA
Stock
47,997
In Stock :
47,997

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Number of Terminations :
676
JESD-609 Code :
e1
Operating Temperature :
-40°C~100°C TJ
Voltage - Supply :
1.425V~1.575V
Number of Pins :
676
Terminal Pitch :
1mm
Number of Gates :
1500000
Total RAM Bits :
276480
Radiation Hardening :
No
RoHS Status :
RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Lifecycle Status :
IN PRODUCTION (Last Updated: 3 weeks ago)
Length :
27mm
Height :
1.73mm
Number of I/O :
252
Supply Voltage :
1.5V
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.5V
Time@Peak Reflow Temperature-Max (s) :
40
Published :
2013
Peak Reflow Temperature (Cel) :
250
Weight :
400.011771mg
Base Part Number :
M1AFS1500
Series :
Fusion®
Terminal Position :
BOTTOM
Max Frequency :
1.47059GHz
Factory Lead Time :
12 Weeks
Package / Case :
676-BGA
RAM Size :
33.8kB
Width :
27mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Speed Grade :
2
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Registers :
38400
Terminal Form :
Ball
Mount :
Surface Mount
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology M1AFS1500-2FGG676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Operating Temperature:-40°C~100°C TJ, Number of Pins:676, Mounting Type:Surface Mount, Base Part Number:M1AFS1500, Package / Case:676-BGA, M1AFS1500-2FGG676I pinout, M1AFS1500-2FGG676I datasheet PDF, M1AFS1500-2FGG676I amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology M1AFS1500-2FGG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology M1AFS1500-2FGG676I


FPGAs Microchip Technology M1AFS1500-2FGG676I Overview

The FPGAs Microchip Technology M1AFS1500-2FGG676I represents a highly versatile, field-programmable gate array designed for optimal performance in complex digital circuits. Developed by Microchip Technology, this advanced FPGA features 252 I/O pins encapsulated in a 676-pin fine ball grid array (FBGA) package, making it ideally suited for applications requiring a high degree of customization and speed. The M1AFS1500-2FGG676I is engineered to address the needs of demanding data processing environments, offering a robust platform for developers looking to integrate flexible logic configurations with high signal integrity and minimal latency.

M1AFS1500-2FGG676I Features

This FPGA is equipped with a rich set of features including a high I/O pin count, a dense 676 FBGA package for efficient space utilization, and programmable logic that supports a variety of digital computation tasks. These features enable the device to perform exceptionally well in multi-faceted, high-speed digital processing tasks, while providing the flexibility needed to adapt to new and evolving technological requirements.

M1AFS1500-2FGG676I Applications

  • Telecommunications Equipment: Utilized in routers and switches for packet processing capabilities that require high-speed data transfer and signal integrity.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple real-time inputs from vehicle sensors.
  • Industrial Automation: Ideal for control systems in manufacturing lines, where programmability allows for customized logic sequences and real-time operations monitoring.
  • Consumer Electronics: Used in home entertainment systems, such as smart TVs and gaming consoles, for handling complex graphics processing and user interface enhancements.
  • Medical Devices: Assists in diagnostic equipment where precise and rapid processing of digital signals is crucial for accurate results.
This HTML content provides an in-depth overview and feature list for the FPGAs Microchip Technology M1AFS1500-2FGG676I, including specific applications in various high-demand fields, tailored to B2B clients looking for scalable and adaptable technology solutions.
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